Method for crystallizing silicon using a ramp shaped laser beam

1. A crystallization method, comprising:

forming an amorphous silicon layer on a substrate;

performing a first crystallization process by irradiating the amorphous silicon layer with a first laser beam having an asymmetrical upper cross sectional energy density profile of a ramp shape that descends in a scanning direction to form a first lateral crystallization region, wherein the asymmetrical upper cross sectional energy density profile is not flat, and wherein the first crystallization process is performed by a sequential lateral crystallization method; and

performing a second crystallization process with the laser beam by moving a second laser beam to a predetermined length in a scanning direction so as to be partially overlapped with the first lateral crystallization region formed by the first crystallization process, wherein the second crystallization process is performed by irradiating the amorphous silicon layer with the laser beam having an asymmetrical upper cross sectional energy density profile of a ramp shape that descends in a scanning direction to form a second lateral crystallization region, and wherein the second crystallization process is performed by a sequential lateral crystallization method, wherein the second crystallization process overlaps with the first lateral crystallization region, and the first lateral crystallization region irradiated with the first laser beam has a larger grain size than the second lateral crystallization region irradiated with the second laser beam having a lower peak than that of the first laser beam, and a crystallization region comprises the first and second crystallization regions,

wherein the first lateral crystallization region and the second lateral crystallization region are formed by a first laser pulse so the lateral crystallization occurs in a direction towards the center by using the amorphous silicon at the sides as seeds for crystal growth, and a grain boundary is formed to the right of center of the first laser pulse, to accomplish sequential lateral solidification, and wherein the first lateral crystallization region is relatively larger than the second lateral crystallization region; and

a second laser pulse is irradiated after moving a laser generator to a predetermined length less than a length of the first lateral crystallization region so that some parts of the first lateral crystallization region are overlapped, to accomplish crystallization again, wherein the crystallization is performed subsequent to the first lateral crystallization region as the first lateral crystallization region acts as seeds, to form a bigger grain.

2. The method of claim 1 , wherein the first laser beam has an energy density to completely melt the amorphous silicon layer.

3. The method of claim 1 , wherein the first and second crystallization regions formed by irradiating the first and second laser beams are asymmetrical.

4. A method of fabricating a liquid crystal display device, comprising:

forming an amorphous silicon layer on a substrate;

a first crystallization step of forming an asymmetrical crystallization region by irradiating the amorphous silicon layer with a first laser beam having an asymmetric upper cross sectional energy density profile of a ramp shape that descends in a scanning direction, wherein the asymmetrical upper cross sectional energy density profile is not flat; and

a second crystallization step of irradiating the laser beam by moving a second laser beam in the scanning direction so as to overlap a portion of the crystallization region, wherein the second crystallization step is performed by irradiating the amorphous silicon layer with the second laser beam having an asymmetric upper cross sectional energy density profile of a ramp shape that descends in a scanning direction, and wherein the laser beam having a ramp shaped cross sectional profile is provided with a first region having a maximum energy peak and a second region having a minimum energy peak, and the first region corresponds to a first lateral crystallization region and the second region corresponds to a second lateral crystallization region,

wherein the second crystallization step is performed by moving the second laser beam by steps so that some parts of the second laser beam overlap with the first region, and wherein the second crystallization process overlaps with the first region, and the first region irradiated with the first laser beam has a larger grain size than the second region irradiated with the second laser beam having a lower peak than that of the first laser beam, and a crystallization region comprises the first and second regions,

wherein the first lateral crystallization region and the second lateral crystallization region are formed by a first laser pulse so that lateral crystallization occurs in a direction towards the center by using the amorphous silicon at the sides as seeds for crystal growth, and a grain boundary is formed to the right of center of the first laser pulse, to accomplish sequential lateral solidification, and wherein the first lateral crystallization region is relatively larger than the second lateral crystallization region; and

a second laser pulse is irradiated after moving a laser generator to a predetermined length less than a length of the first lateral crystallization region so that some parts of the first lateral crystallization region are overlapped, to accomplish crystallization again, wherein the crystallization is performed subsequent to the first lateral crystallization region as the first lateral crystallization region acts as seeds, to form a bigger grain; and

crystallizing the entire amorphous silicon layer by repeating the first crystallization step and the second crystallization step.

5. The method of claim 4 , wherein the asymmetrical crystallization region consists of the first lateral crystallization region and of the second lateral crystallization region shorter than the first lateral crystallization region.

6. The method of claim 4 , further comprising:

forming an active layer by patterning the crystallized silicon layer;

forming a gate insulating layer on the active layer;

forming a gate electrode on the gate insulating layer;

forming source and drain electrodes connected to the active layer; and

forming a pixel electrode connected to the drain electrode.

7. A method of fabricating a liquid crystal display device, comprising:

forming an amorphous silicon layer on a substrate;

a first crystallization step of irradiating the amorphous silicon layer with a first laser beam having an asymmetric upper cross sectional energy density profile of a ramp shape that descends in a scanning direction to a first asymmetrical lateral crystallization region, wherein the asymmetrical upper cross sectional energy density profile is not flat; and

a second crystallization step of irradiating a second laser beam by moving the first laser beam in the scanning direction so as to overlap a portion of the first asymmetrical lateral crystallization region to form a second asymmetrical lateral crystallization region, wherein the second crystallization step is performed by irradiating the amorphous silicon layer with the second laser beam having an asymmetric upper cross sectional energy density profile of a ramp shape that descends in a scanning direction, wherein the first laser beam having a ramp shaped cross sectional profile is provided with a first region having a maximum energy peak and a second region having a minimum energy peak, and the first region corresponds to the first asymmetrical lateral crystallization region and the second region corresponds to the second asymmetrical lateral crystallization region, and the second crystallization step is performed by moving the second laser beam by steps so that some parts of the laser beam overlap with the first region,

wherein the first asymmetrical lateral crystallization region and the second asymmetrical lateral crystallization region are formed by a first laser pulse so the lateral crystallization occurs in a direction towards the center by using the amorphous silicon at the sides as seeds for crystal growth, and a grain boundary is formed to the right of center of the first laser pulse, to accomplish sequential lateral solidification, and wherein the first asymmetrical lateral crystallization region is relatively larger than the second asymmetrical lateral crystallization region; and

a second laser pulse is irradiated after moving a laser generator to a predetermined length less than a length of the first asymmetrical lateral crystallization region so that some parts of the first asymmetrical lateral crystallization region are overlapped, to accomplish crystallization again, wherein the crystallization is performed subsequent to the first asymmetrical lateral crystallization region as the first asymmetrical lateral crystallization region acts as seeds, to form a bigger grain;

crystallizing the entire amorphous silicon layer by repeating the first crystallization step and the second crystallization step;

forming an active layer by patterning the crystallized silicon layer;

forming a gate insulating layer on the active layer;

forming a gate electrode on the gate insulating layer;

forming source and drain electrodes connected to the active layer; and

forming a pixel electrode connected to the drain electrode.

8. The method of claim 7 , wherein a crystallization region consists of a first asymmetrical lateral crystallization region and a second asymmetrical lateral crystallization region shorter than the first asymmetrical lateral crystallization region.