Laminated microfluidic structures and method for making
View Patent ↗A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time with RF or ultrasonic energy. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation. A laminated, polymeric microfluidic structure is also disclosed.
1. A method for laminating at least two polymeric components to form a laminated, polymeric microfluidic structure, comprising:
applying a weak solvent to a surface of one of the at least two components,
wherein the weak solvent has a chemical formula of:
where,
R1=H or R, where R=alkyl,
R2=H or R, where R=alkyl, and
R3=H or R, where R=alkyl;
adjacently contacting opposing surfaces, including the surface having the applied weak solvent, of the at least two components; and
creating a thermal activation condition for thermally activating the weak solvent, wherein the thermal activation condition includes at least one of applying radio frequency energy and ultrasonic energy.
2. The method of claim 1 , further comprising applying pressure to the at least two components while thermally activating the applied weak solvent.
3. The method of claim 2 , further comprising aligning the at least two components prior to thermally activating the applied weak solvent.
4. The method of claim 1 , further comprising sliding the at least two components into a desired alignment after applying the weak solvent and adjacently contacting opposing surfaces of the at least two components.
5. The method of claim 1 , comprising increasing the temperature of an interface containing the bonding agent to a temperature less than the melting temperature of the interface.
6. The method of claim 1 , comprising increasing the temperature of the interface to between about 24 to 45 degrees Celsius.
7. A method for laminating at least two polymeric components to form a laminated, polymeric microfluidic structure, comprising:
applying a weak solvent to a surface of one of the at least two components, wherein the weak solvent has a chemical formula of:
where,
R1=H or R, where R=alkyl, and
R2=H or R, where R=alkyl;
adjacently contacting opposing surfaces, including the surface having the applied weak solvent, of the at least two components; and
creating a thermal activation condition for thermally activating the weak solvent, wherein the thermal activation condition includes at least one of applying radio frequency energy and ultrasonic energy.
8. The method of claim 7 , further comprising applying pressure to the at least two components while thermally activating the applied weak solvent.
9. The method of claim 8 , further comprising aligning the at least two components prior to thermally activating the applied weak solvent.
10. The method of claim 7 , further comprising sliding the at least two components into a desired alignment after applying the weak solvent and adjacently contacting opposing surfaces of the at least two components.
11. The method of claim 7 , comprising increasing the temperature of an interface containing the bonding agent to a temperature less than the melting temperature of the interface.
12. The method of claim 7 , comprising increasing the temperature of the interface to between about 24 to 45 degrees Celsius.
13. A method for laminating at least two polymeric components to form a laminated, polymeric microfluidic structure, comprising:
applying a weak solvent to a surface of one of the at least two components, wherein the weak solvent has a chemical formula of:
where,
R1=H or R, where R=alkyl;
adjacently contacting opposing surfaces, including the surface having the applied weak solvent, of the at least two components; and
creating a thermal activation condition for thermally activating the weak solvent, wherein the thermal activation condition includes at least one of applying radio frequency energy and ultrasonic energy.
14. The method of claim 13 , further comprising applying pressure to the at least two components while thermally activating the applied weak solvent.
15. The method of claim 14 , further comprising aligning the at least two components prior to thermally activating the applied weak solvent.
16. The method of claim 13 , further comprising sliding the at least two components into a desired alignment after applying the weak solvent and adjacently contacting opposing surfaces of the at least two components.
17. The method of claim 13 , comprising increasing the temperature of an interface containing the bonding agent to a temperature less than the melting temperature of the interface.
18. The method of claim 13 , comprising increasing the temperature of the interface to between about 24 to 45 degrees Celsius.
19. A method for laminating at least two polymeric components to form a laminated, polymeric microfluidic structure, comprising:
applying a weak solvent to a surface of one of the at least two components, wherein the weak solvent is acetonitrile;
adjacently contacting opposing surfaces, including the surface having the applied weak solvent, of the at least two components; and
creating a thermal activation condition for thermally activating the weak solvent, wherein the thermal activation condition includes at least one of applying radio frequency energy and ultrasonic energy.
20. The method of claim 19 , further comprising applying pressure to the at least two components while thermally activating the applied weak solvent.
21. The method of claim 20 , further comprising aligning the at least two components prior to thermally activating the applied weak solvent.
22. The method of claim 19 , further comprising sliding the at least two components into a desired alignment after applying the weak solvent and adjacently contacting opposing surfaces of the at least two components.
23. The method of claim 19 , comprising increasing the temperature of an interface containing the bonding agent to a temperature less than the melting temperature of the interface.
24. The method of claim 19 , comprising increasing the temperature of the interface to between about 24 to 45 degrees Celsius.