Resin composition for sealing light emitting device
A curable composition for sealing a light emitting device, comprising a modified polysiloxane containing, in a molecule, not less than one alicyclic hydrocarbon group and not less than two epoxy groups.
1. A process for producing a light emitting device comprising the steps of:
(i) sealing a light emitting device with a heat-curable composition comprising
a modified polysiloxame containing, in a molecule, not less than one alicyclic hydrocarbon group and not less than two epoxy groups wherein the alicyclic hydrocarbon group is a nobornyl group and/or a cyclohexyl group that is not substituted by an epoxy group, the epoxy group is an ethynylcyclohexene oxide group, and the substituent having the epoxy group and the polysiloxane are bonded through a Si—C bond, and
a curing agent for an epoxy resin, and
(ii) heat-curing said heat-curable composition of the light emitting device,
wherein the modified polysiloxane is represented by the formula (1) or the formula (2)
where R 1 is hydrogen, a hydroxyl group, an aliphatic hydrocarbon group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, R 2 is an ethynylcyclohexane oxide group, R 3 is a norbornyl group and/or a cyclohexyl group that is not substituted by an epoxy group, R 4 is any group of R 1 to R 3 , p and r are each an integer of 0≦p≦50 and 1≦r≦50, and q is an integer of 0≦q≦50 when two R 4 s are both R 2 , 1≦q≦50 when one of the R 4 s is R 2 , and 2≦q≦50 when neither of the two R 4 s is R 2 or no R 4 is present.
2. The process according to claim 1 , wherein said heat-curable composition contains not more than 20 ppm of transition metal components in total in terms of an element.
3. The process according to claim 1 , wherein the modified polysiloxane has an APHA color number of not more the 50.
4. The process according to any of claims 1 , 2 , or 3 , wherein said heat-curable composition comprises
100 parts by mass of the modified polysiloxane 0.1 to 100 parts by mass of an epoxy resin and 1 to 200 parts by mass of the curing agent for the epoxy resin.
5. A light emitting device or a display device using said light emitting device, said light emitting device being produced by using the process according to any of claims 1 , 2 , or 3 .
6. A light emitting component and a display device using the component, said component being produced by sealing a heat-curable composition comprising
100 parts by mass of a modified polysiloxane containing, in a molecule, not less than one alicyclic hydrocarbon group and not less than two epoxy groups wherein the alicyclic hydrocarbon group is a norbonyl group and/or a cyclohexyl group that is not substituted by an epoxy group, the epoxy group is an ethynylcyclohexene oxide group, and the substituent having the epoxy group and the polysiloxane are bonded through a Si—C bond,
0.1 to 100 parts by mass of an epoxy resin, and
1 to 200 parts by mass of curing agent for the epoxy resin
wherein the modified polysiloxane is represented by the formula (1) or the formula (2)
where R 1 is hydrogen, a hydroxyl group, an aliphatic hydrocarbon group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, R 2 is an ethynylcyclohexene oxide group, R 3 is a norbonyl group and/or a cyclohexyl group that is not substituted by an epoxy group, R 4 is any group of R 1 to R 3 , p and r are each an integer of 0≦p≦50 and 1≦r≦50, and q is an integer of 0≦q≦50 when two R 4 s are both R 2 , 1≦q≦50 when one of the two R 4 s is R 2 , and 2≦q≦50 when neither of the two R 4 s is R 2 or no R 4 is present.