Nitride semiconductor light-emitting device and method for fabrication thereof
View Patent ↗A nitride semiconductor laser device uses a substrate with low defect density, contains reduced strains inside a nitride semiconductor film, and thus offers a satisfactorily long useful life. On a GaN substrate ( 10 ) with a defect density as low as 10 6 cm −2 or less, a stripe-shaped depressed portion ( 16 ) is formed by etching. On this substrate ( 10 ), a nitride semiconductor film ( 11 ) is grown, and a laser stripe ( 12 ) is formed off the area right above the depressed portion ( 16 ). With this structure, the laser stripe ( 12 ) is free from strains, and the semiconductor laser device offers a long useful life. Moreover, the nitride semiconductor film ( 11 ) develops reduced cracks, resulting in a greatly increased yield rate.
1. A nitride semiconductor laser device comprising:
a substrate whose top surface is a nitride semiconductor layer; and
a nitride semiconductor film laid directly onto the top surface of the substrate and having a stripe-shaped laser light waveguide structure, wherein
the top surface of the substrate has a low defect region with a defect density of 10 6 cm −2 or less,
a carved region is formed in the top surface of the substrate in the low defect region of the substrate,
a non-carved region is formed in the top surface of the substrate,
the nitride semiconductor film lies above both the carved region and the non-carved region,
the laser light waveguide structure in the nitride semiconductor film is formed right above the non-carved region, and
the laser light waveguide structure in the nitride semiconductor film is formed in a region located 5 μm or more away from the nearest edge of the carved region in the top surface of the substrate.
2. A nitride semiconductor light-emitting device comprising:
a substrate whose top surface is a nitride semiconductor layer; and
a nitride semiconductor film laid directly onto the top surface of the substrate and having light-emitting region, wherein
the top surface of the substrate has a low defect region with a defect density of 10 6 cm −2 or less,
at least one carved region is formed in the top surface of the substrate in the low defect region of the substrate,
a non-carved region is formed in the top surface of the substrate,
the nitride semiconductor film lies in contact with both the carved region and the non-carved region,
the light-emitting region in the nitride semiconductor film is formed right above the non-carved region, and
the light-emitting region in the nitride semiconductor film is formed in a region located 5 μm or more away from the nearest edge of the carved region in the top surface of the substrate.
3. A nitride semiconductor laser device comprising:
a substrate whose top surface is a nitride semiconductor layer; and
a nitride semiconductor film laid directly onto the top surface of the substrate and having a stripe-shaped laser light waveguide structure, wherein
the top surface of the substrate has a low defect region with a defect density of 10 6 cm −2 or less,
the top surface of the substrate has a carved region and a high-flatness region, the carved region being formed by etching in the top surface of the substrate in the low defect region of the substrate,
the nitride semiconductor film is formed on the substrate,
a depressed portion is formed only in a part of the nitride semiconductor film right above the carved region,
the laser light waveguide structure in the nitride semiconductor film is formed right above the high-flatness region, and
the laser light waveguide structure in the nitride semiconductor film is formed in a region located 5 μm or more away from the nearest edge of the carved region in the top surface of the substrate.
4. A nitride semiconductor light-emitting device comprising:
a substrate whose top surface is a nitride semiconductor layer; and
a nitride semiconductor film laid directly onto the top surface of the substrate and having a light emitting region, wherein
the top surface of the substrate has a low defect region with a defect density of 10 6 cm −2 or less,
the top surface of the substrate has a carved region and a high-flatness region, the carved region being formed by etching in the top surface of the substrate in the low defect region of the substrate,
the nitride semiconductor film is formed on the substrate,
a depressed portion is formed only in a part of the nitride semiconductor film right above the carved region,
the light-emitting region in the nitride semiconductor film is formed right above the high-flatness region, and
the light-emitting region in the nitride semiconductor film is formed in a region located 5 μm or more away from the nearest edge of the carved region in the top surface of the substrate.