IP Library Granted Patent US 7,920,043
Granted Patent B2
US 7,920,043 · App. 12/091,619 · Granted Apr 5, 2011

Planar magnetic device and power supply IC package using same

Assignees: Kabushiki Kaisha Toshiba; Toshiba Materials Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,920,043
App. No.
12/091,619
Granted
Apr 5, 2011
Kind
B2
Abstract

A planar magnetic device 1 includes a first magnetic layer 3 and a second magnetic layer 5 that are made of a mixture of a magnetic powder 7 and a resin, and a planar coil 4 disposed between the magnetic layers. When the planar coil 4 has an adjacent winding interval W between the potions 4 c of the coil and the magnetic powder 7 has a maximum particle size L, planar magnetic device 1 satisfies the relationship W>L. In the planar magnetic device 1 having the above structure, fine magnetic powder that can produce a high inductance fills the spaces between the adjacent windings. Thus, the invention can achieve a high-performance planar magnetic device, such as a thin inductor.

Claims (26)

1. A planar magnetic device comprising:

a first magnetic layer and a second magnetic layer that are made of a mixture of a magnetic powder and a resin; and

a planar coil disposed between the first magnetic layer and the second magnetic layer,

wherein the planar coil and the magnetic powder satisfy the relationship W >2L, where W represents the intervals between adjacent windings of the planar coil and L represents the maximum particle size of the magnetic powder,

wherein the intervals W between adjacent windings of the planar coil are filled with the mixture of the magnetic powder and the resin, and the planar magnetic device has a thickness of 0.4 mm or less,

wherein at least three particles of the magnetic powder are disposed in a segment having a length w defined by the adjacent winding interval W of the planar coil, and an insulating layer is not formed between the magnetic layers and the planar coil, and

wherein the magnetic powder contained in the magnetic layer is close to the planar coil at a distance of 1 μm or less or is in contact with the planar coil, the thickness of the planar coil is 10 to 200 μm, and the interval W is 10 μm or more.

2. The planar magnetic device according to claim 1 , wherein at least five particles of the magnetic powder are disposed in the segment having the length W defined by the adjacent winding interval W.

3. The planar magnetic device according to claim 1 , wherein the magnetic powder contains at least one selected from the group consisting of amorphous alloys, fine crystal alloys, pure iron, sendust, Fe-Ni alloys, Fe-Si alloys, and ferrites.

4. The planar magnetic device according to claim 1 , wherein the magnetic powder has an average particle size of 80 μm or less.

5. The planar magnetic device according to claim 1 , wherein the planar coil is made of a sintered body of metal powder.

6. The planar magnetic device according to claim 1 , wherein the planar coil is formed by etching a metal foil.

7. A power IC package comprising:

a planar magnetic device comprising:

a first magnetic layer and a second magnetic layer that are made of a mixture of a magnetic powder and a resin; and

a planar coil disposed between the first magnetic layer and the second magnetic layer,

wherein the planar coil and the magnetic powder satisfy the relationship W >2L, where W represents the intervals between adjacent windings of the planar coil and L represents the maximum particle size of the magnetic powder, and

wherein the intervals W between adjacent windings of the planar coil are filled with the mixture of the magnetic powder and the resin, and the planar magnetic device has a thickness of 0.4 mm or less,

wherein at least three particles of the magnetic powder are disposed in a segment having a length w defined by the adjacent winding interval W of the planar coil, and an insulating layer is not formed between the magnetic layers and the planar coil, and

wherein the magnetic powder contained in the magnetic layer is close to the planar coil at a distance of 1 μm or less or is in contact with the planar coil, the thickness of the planar coil is 10 to 200 μm, and the interval W is 10 μm or more.

8. The power IC package according to claim 7 , wherein the power IC package is integrated with an IC.

9. The planar magnetic device according to claim 7 , wherein at least five particles of the magnetic powder are disposed in the segment having the length W defined by the adjacent winding interval W.

10. The planar magnetic device according to claim 7 , wherein the magnetic powder contains at least one selected from the group consisting of amorphous alloys, fine crystal alloys, pure iron, sendust, Fe-Ni alloys, Fe-Si alloys, and ferrites.

11. The planar magnetic device according to claim 7 , wherein the magnetic powder has an average particle size of 80 μm or less.

12. The planar magnetic device according to claim 7 , wherein the planar coil is made of a sintered body of metal powder.

13. The planar magnetic device according to claim 7 , wherein the planar coil is formed by etching a metal foil.

Assignments (4)
NUNC PRO TUNC ASSIGNMENT Recorded Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO. LTD.
Reel/Frame 074940/0511 →
CHANGE OF NAME Recorded Feb 19, 2026
From: TOSHIBA MATERIALS CO. LTD.
To: NITERRA MATERIALS CO., LTD.
Reel/Frame 074941/0803 →
CHANGE OF ADDRESS Recorded Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 074941/0846 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2008
From: NAKAGAWA, KATSUTOSHI; INOUE, TETSUO; SATO, AKIRA
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA MATERIALS CO., LTD.
Reel/Frame 020857/0528 →
Priority Claims (1)
JP 2005-313311 · Oct 27, 2005 · national
Continuity (1)
Related Publication 20090045905A1 · Feb 19, 2009