Salt of carboxyethyl phosphinate ester and flame retardant thermoplastic resin composition containing the same
A composition includes a salt of a carboxyethyl phosphinate ester compound. Additionally, the composition may also include a polymeric resin, such as a thermoplastic resin. The composition may have improved physical and chemical properties including flame retardancy, thermal stability, and hygroscopicity.
1. A compound represented by Formula (I):
wherein R 1 is independently selected from the group consisting of C 1 -C 6 alkyl, C 6 -C 20 aryl group and alkyl-substituted C 6 -C 20 aryl,
wherein R 2 is independently selected from the group consisting of C 1 -C 6 alkyl, C 6 -C 30 aryl, and alkyl-substituted C 6 -C 30 aryl group,
wherein n is 1, 2, 3 or 4, and
wherein M is selected from the group consisting of Al, melem and alkyl imidazole.
2. The compound of claim 1 , wherein R 1 is independently selected from the group consisting of methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl and phenyl.
3. The compound of claim 1 , wherein R 2 is independently selected from the group consisting of methyl, ethyl, propyl, isopropyl, butyl, hexyl and phenyl.
4. A composition comprising:
a polymeric resin; and
the compound of claim 1 .
5. The composition of claim 4 , wherein the composition comprises about 0.1 to about 50 parts by weight of the compound represented by Formula (I), based on 100 parts by weight of the polymeric resin.
6. The composition of claim 4 , wherein the polymeric resin comprises one or more from the group consisting of polystyrene resin (PS resin), acrylonitrile-butadiene-styrene terpolymer resin (ABS resin), rubber-modified high impact polystyrene resin (HIPS), acrylonitrile-styrene-acrylate terpolymer resin (ASA resin), acrylonitrile-styrene copolymer resin (SAN resin), methylmethacrylate-butadiene-styrene terpolymer resin (MBS resin), acrylonitrile-ethylacrylate-styrene terpolymer resin (AES resin), polycarbonate resin (PC resin), polyphenylene ether resin (PPE resin), polyethylene resin (PE resin), polypropylene resin (PP resin), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polymethyl methacrylate (PMMA), polyamide (PA) resin, and copolymers thereof.
7. The composition of claim 4 , further comprising a phosphate ester.
8. The composition of claim 7 , wherein the composition comprises about 0.1 to about 40 parts by weight of the phosphate ester, based on 100 parts by weight of the polymeric resin.
9. The composition of claim 7 , wherein the phosphate ester comprises a compound represented by the following Formula (II):
wherein each R is independently hydrogen or C 1-4 alkyl;
X is derived from an aryl compound comprising at least two hydroxy groups;
and n is 0 to 4.
10. The composition of claim 9 , wherein the aryl compound comprising at least two hydroxy groups is selected from the group consisting of resorcinol, hydroquinone, bisphenol-A, and combinations thereof.
11. The composition of claim 4 , formed as a shaped article.
12. The composition of claim 4 , wherein the composition has flame retardancy of at least V-1, when a specimen of the composition is tested according to the standard UL-94 VB.
13. The composition of claim 4 , wherein the composition has flame retardancy of V-0, when a specimen of the composition is tested according to the standard UL-94 VB.
14. The composition of claim 4 , wherein the composition has Δ E of less than or equal to about 0.5, when a specimen of the composition measuring 5 cm×20 cm×0.32 cm is exposed to 270° C. for 10 minutes.
15. The composition of claim 4 , wherein the composition has Δ E of less than or equal to about 0.3, when the specimen of the composition measuring 5 cm×20 cm×0.32 cm is exposed to 270° C. for 10 minutes.
16. The composition of claim 4 , wherein the composition has hygroscopicity of less than or equal to about 0.4%, when a specimen of the composition measuring 10 cm×10 cm×0.32 cm is allowed to stand in a thermostatic bath at 60° C. for 24 hours.
17. The composition of claim 4 , wherein the composition has hygroscopicity of less than or equal to about 0.3%, when a specimen of the composition measuring 10 cm×10 cm×0.32 cm is allowed to stand in a thermostatic bath at 60° C. for 24 hours.
18. An electronic device comprising the composition of claim 4 .
19. A method of making a plastic structure comprising molding the composition of claim 4 into a molded structure.