IP Library Granted Patent US 7,948,049
Granted Patent B2
US 7,948,049 · App. 12/723,672 · Granted May 24, 2011

Photodiode and photodiode array with improved performance characteristics

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Quick Facts
Patent No.
US 7,948,049
App. No.
12/723,672
Granted
May 24, 2011
Kind
B2
Abstract

The present invention is a photodiode and/or photodiode array, having a p+ diffused area that is smaller than the area of a mounted scintillator crystal, designed and manufactured with improved device characteristics, and more particularly, has relatively low dark current, low capacitance and improved signal-to-noise ratio characteristics. More specifically, the present invention is a photodiode and/or photodiode array that includes a metal shield for reflecting light back into a scintillator crystal, thus allowing for a relatively small p+ diffused area.

Claims (27)

1. A photodiode comprising:

a low resistivity substrate having at least a front side and a back side, wherein said low resistivity is less than 2000 ohm cm;

a shallow p+ diffused region on said front side, wherein said shallow p+ region is smaller than a scintillator mounted on the front side of the photodiode;

at least one back side contact and at least one front side contact, comprised of metal; and

a reflective metal shield on at least a portion of said front side, wherein said metal shield reflects incident light back into said scintillator.

2. The photodiode of claim 1 wherein said scintillator is a crystal and wherein said crystal is mounted on the front side of the photodiode.

3. The photodiode of claim 1 wherein the shallow p+ diffused region is on the order of 1 mm or less in length and 1 mm or less in width.

4. The photodiode of claim 1 wherein the reflective metal shield comprises aluminum.

5. The photodiode of claim 1 , wherein a distance between the shallow p+ diffused region and an edge of the photodiode ranges from 0.3 mm to 0.5 mm.

6. The photodiode of claim 1 further comprising an anti-reflective layer formed from SiO 2 having a thickness of 900 Å.

7. The photodiode of claim 1 further comprising an anti-reflective layer formed from SiO 2 having a thickness of 150 Å and Si 3 N 4 having a thickness of 400 Å, for a total layer thickness of 550 Å.

8. A photodiode array comprising:

a substrate having at least a front side and a back side;

a plurality of diode elements integrally formed in the substrate forming said array, wherein each diode element has a shallow p+ diffused region on said front side, wherein said shallow p+ region is smaller than a scintillator mounted on the front side of the photodiode;

at least one front side contact, comprised of metal; and

a reflective metal shield on at least a portion of said front side, wherein said metal shield reflects incident light back into the scintillator.

9. The photodiode array of claim 8 wherein said scintillator comprises crystal and wherein said crystal is mounted on the front side of the photodiode element.

10. The photodiode array of claim 8 wherein the shallow p+ diffused region is approximately 1 mm or less in length.

11. The photodiode of claim 1 wherein said low resistivity is greater than 1000 ohm cm.

12. The photodiode of claim 1 wherein said back side contact is a cathode contact.

13. The photodiode of claim 1 wherein said front side contact is an anode contact.

14. The photodiode of claim 1 wherein said scintillator comprises a crystal, wherein said crystal has a top surface area of 2 mm×2 mm.

15. The photodiode array of claim 8 wherein the substrate is a low resistivity substrate and wherein said low resistivity is in the range of 1000 ohm cm to 2000 ohm cm.

16. The photodiode array of claim 8 further comprising at least one back side cathode contact.

17. The photodiode array of claim 15 wherein said at least one front side contact is an anode contact.

18. The photodiode array of claim 9 wherein said scintillator crystal has a top surface area of 2 mm×2 mm.

19. The photodiode array of claim 10 wherein the shallow p+ diffused region is approximately 1 mm or less in width.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jul 1, 2025
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: OSI OPTOELECTRONICS, INC.
Reel/Frame 071581/0725 →
NUNC PRO TUNC ASSIGNMENT Recorded Feb 22, 2011
From: BUI, PETER STEVEN; TANEJA, NARAYAN DASS
To: OSI OPTOELECTRONICS, INC.
Reel/Frame 025846/0047 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Oct 19, 2010
From: OSI OPTOELECTRONICS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 025150/0964 →