IP Library Granted Patent US 7,948,784
Granted Patent B2
US 7,948,784 · App. 12/230,235 · Granted May 24, 2011

Semiconductor memory device having vertical transistors

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Quick Facts
Patent No.
US 7,948,784
App. No.
12/230,235
Granted
May 24, 2011
Kind
B2
Abstract

A semiconductor memory device includes a memory cell array region in which vertical transistors each having a lower electrode connected to a bit line is regularly arranged with a predetermined pitch, including memory cells formed using at least the vertical transistors; a peripheral circuit region arranged adjacent to the memory cell array region in a bit line extending direction; and a predetermined circuit arranged overlapping the peripheral circuit region and the memory cell array region. In the semiconductor memory device, the vertical transistors each having an upper electrode connected to the predetermined circuit are included in an end region of the memory cell array region, in which no word line is provided.

Claims (19)

1. A semiconductor memory device having a plurality of memory cells arranged at intersections of a plurality of word lines and a plurality of bit lines intersecting therewith, comprising:

a memory cell array region in which a plurality of vertical transistors each having a lower electrode connected to each bit line is regularly arranged with a predetermined pitch, said memory cell array region including the plurality of memory cells formed using at least the vertical transistors;

a peripheral circuit region arranged adjacent to said memory cell array region in a bit line extending direction; and

a predetermined circuit arranged overlapping said peripheral circuit region and said memory cell array region;

wherein one or more of the vertical transistors each having an upper electrode connected to said predetermined circuit are included in an end region of said memory cell array region, in which no word line is provided.

2. The semiconductor memory device according to claim 1 , wherein one or more of the vertical transistors each having an upper electrode connected to a transistor in said peripheral circuit region are included in the end region.

3. The semiconductor memory device according to claim 1 , wherein one or more of the vertical transistors each having an upper electrode connected to a wiring extending in said peripheral circuit region are included in the end region.

4. The semiconductor memory device according to claim 1 , wherein each of the vertical transistors as the memory cell has an upper electrode connected to an accumulation electrode of a capacitor capable of storing information in accordance with a charge amount, and has a gate electrode connected to each word line.

5. The semiconductor memory device according to claim 1 , wherein each of the vertical transistors as the memory cell has an upper electrode connected to one end of a variable resistor element capable of storing information in accordance with a resistance state, and has a gate electrode connected to each word line.

6. The semiconductor memory device according to claim 1 , wherein said predetermined circuit includes a sense amplifier circuit for amplifying a signal read out from the memory cell through the bit line.

7. The semiconductor memory device according to claim 6 ,

wherein each of the bit line is a local bit line corresponding to a hierarchical structure, and the sense amplifier circuit is a local sense amplifier circuit for amplifying a signal read out through the local bit line,

and a plurality of global bit lines intersecting with the plurality of word lines and a global sense amplifier circuit for amplifying a signal transmitted from the local sense amplifier circuit through the global bit line are further provided.

8. The semiconductor memory device according to claim 6 ,

wherein each of the bit line is a local bit line corresponding to a hierarchical structure,

a plurality of global bit lines intersecting with the plurality of word lines and a sense amplifier circuit for amplifying a signal transmitted from the memory cell through the local bit line and the global bit line are further provided,

and said predetermined circuit includes a connection circuit for selectively connecting the local bit line and the global bit line.

9. The semiconductor memory device according to claim 1 , wherein said predetermined circuit includes a precharge circuit for precharging the bit line to a predetermined voltage.

10. The semiconductor memory device according to claim 1 , wherein one or more of the vertical transistors which is not included in said predetermined circuit are arranged each as a dummy transistor in the end region.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046865/0667 →
CHANGE OF NAME Recorded Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032896/0001 →
SECURITY AGREEMENT Recorded Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2008
From: KAJIGAYA, KAZUHIKO
To: ELPIDA MEMORY, INC.
Reel/Frame 021493/0346 →