IP Library Granted Patent US 7,952,136
Granted Patent B2
US 7,952,136 · App. 11/874,004 · Granted May 31, 2011

Nonvolatile semiconductor storage apparatus and method for manufacturing the same

Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 7,952,136
App. No.
11/874,004
Granted
May 31, 2011
Kind
B2
Abstract

According to an aspect of the present invention, there is provided a nonvolatile semiconductor storage apparatus including: a substrate; a columnar semiconductor disposed perpendicular to the substrate; a charge storage laminated film disposed around the columnar semiconductor; a first conductor layer that is in contact with the charge storage laminated film and that has a first end portion having a first end face; a second conductor layer that is in contact with the charge storage laminated film, that is separated from the first conductor layer and that has a second end portion having a second end face; a first contact plug disposed on the first end face; and a second contact plug disposed on the second end face.

Claims (32)

1. A nonvolatile semiconductor storage apparatus comprising:

a substrate;

an insulating layer disposed on the substrate;

a columnar semiconductor disposed perpendicular to the substrate;

a laminated film comprising:

a first insulating film disposed around the columnar semiconductor,

a charge storage film disposed around the first insulating film, and

a second insulating film disposed around the charge storage film;

a first conductor layer that is disposed on the insulating layer and that is in contact with the laminated film;

a first interlayer insulating layer disposed on the first conductor layer;

a second conductor layer that is disposed on the first interlayer insulating layer and that is in contact with the laminated film;

a first contact plug that is connected to the first conductor layer; and

a second contact plug that is connected to the second conductor layer;

wherein the first conductor layer comprises a first end portion that is bent upwardly in a direction perpendicular to a surface of the substrate;

wherein the second conductor layer comprises a second end portion that is bent upwardly in the direction perpendicular to a surface of the substrate;

wherein the first end portion comprises a first end face;

wherein the second end portion comprises a second end face;

wherein the first contact plug is disposed on the first end face; and

wherein the second contact plug is disposed on the second end face.

2. The nonvolatile semiconductor storage apparatus according to claim 1 , wherein the columnar semiconductor, the laminated film and the first conductor layer form a first memory cell that operates in a depression mode; and

wherein the columnar semiconductor, the laminated film and the second conductor layer form a second memory cell that operates in the depression mode.

3. The nonvolatile semiconductor storage apparatus according to claim 2 , wherein the first memory cell and the second memory cell form a memory string.

4. The nonvolatile semiconductor storage apparatus according to claim 1 , wherein the first end face has a width that is equal to or larger than a thickness of the first conductor layer.

5. The nonvolatile semiconductor storage apparatus according to claim 1 , wherein the second end face is disposed in the same plane as and the first end face.

6. The nonvolatile semiconductor storage apparatus according to claim 1 , wherein the first conductor layer further comprise a first central portion where the first conductor layer is in contact with the laminated film; and

wherein the first end portion is made of the same material as the first central layer.

7. The nonvolatile semiconductor storage apparatus according to claim 1 , wherein the first end portion forms an angle that is equal to or larger than 45 degree with a surface of the substrate.

8. The nonvolatile semiconductor storage apparatus according to claim 6 , wherein the insulating layer comprises:

a concave portion that is in contact with the first central portion, and

a convex portion that is in contact with the first end portion.

9. The nonvolatile semiconductor storage apparatus according to claim 1 , wherein the first end portion has a straight shape.

10. The nonvolatile semiconductor storage apparatus according to claim 1 , wherein the first end portion has a curved shape.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2008
From: KITO, MASARU; INOUE, HIROFUMI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 020369/0637 →
Priority Claims (1)
JP P2006-283117 · Oct 17, 2006 · national
Continuity (1)
Related Publication 20080099819A1 · May 1, 2008