IP Library Granted Patent US 7,968,898
Granted Patent B2
US 7,968,898 · App. 11/713,761 · Granted Jun 28, 2011

Nitride semiconductor light emitting device, method of manufacturing nitride semiconductor light emitting device, and nitride semiconductor transistor device

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Quick Facts
Patent No.
US 7,968,898
App. No.
11/713,761
Granted
Jun 28, 2011
Kind
B2
Abstract

Provided are a nitride semiconductor light emitting device including a coat film formed at a light emitting portion and including an aluminum nitride crystal or an aluminum oxynitride crystal, and a method of manufacturing the nitride semiconductor light emitting device. Also provided is a nitride semiconductor transistor device including a nitride semiconductor layer and a gate insulating film which is in contact with the nitride semiconductor layer and includes an aluminium nitride crystal or an aluminum oxynitride crystal.

Claims (14)

1. A nitride semiconductor light emitting device including a coat film being in contact with a light emitting portion, said coat film consisting of an aluminum oxynitride crystal, and said light emitting portion being a side surface of said nitride semiconductor light emitting device, wherein said nitride semiconductor light emitting device is a nitride semiconductor laser device, and said coat film is formed on a facet at a light emitting side of said nitride semiconductor laser device.

2. The nitride semiconductor light emitting device according to claim 1 , wherein said aluminum oxynitride crystal has a crystal axis aligned with a crystal axis of a nitride semiconductor crystal forming said light emitting portion.

3. The nitride semiconductor light emitting device according to claim 1 , wherein a thickness of said coat film is at least 6 nm and at most 150 nm.

4. The nitride semiconductor light emitting device according to claim 1 , wherein a film made of an oxide, an oxynitride or a nitride is formed on said coat film.

5. The nitride semiconductor light emitting device according to claim 4 , wherein said film made of an oxide on said coat film is an aluminum oxide film, a silicon oxide film, a titanium oxide film, a hafnium oxide film, a zirconium oxide film, a niobium oxide film, a tantalum oxide film, or an yttrium oxide film.

6. The nitride semiconductor light emitting device according to claim 4 , wherein said film made of an oxynitride on said coat film is an aluminum oxynitride film or a silicon oxynitride film having a composition different from a composition of said coat film.

7. The nitride semiconductor light emitting device according to claim 4 , wherein said film made of a nitride on said coat film is an aluminum nitride film or a silicon nitride film.

8. The nitride semiconductor light emitting device according to claim 1 , wherein a magnesium fluoride film is formed on said coat film.

9. The nitride semiconductor light emitting device according to claim 1 , wherein a substrate made of nitride semiconductor represented by a composition formula of Al s Ga t N (s+t=1, 0≦s≦1, 0≦t≦1) is used as a substrate.

10. The nitride semiconductor light emitting device according to claim 1 , wherein a nitride semiconductor layer is formed on a substrate made of nitride semiconductor, and a growth surface of said semiconductor substrate is C-plane{0001}, A-plane{11-20}, R-plane{1-102}, or M-plane{1- 100}.

11. The nitride semiconductor light emitting device according to claim 10 , wherein said aluminum oxynitride crystal has a crystal axis aligned with a nitride semiconductor crystal forming said light emitting portion.

12. The nitride semiconductor light emitting device according to claim 1 , wherein a nitride semiconductor layer is formed on a substrate made of nitride semiconductor, and an off angle of a growth surface of said semiconductor substrate is within 2° from C-plane{0001}, A-plane{11-20}, R-plane{1-102}, or M-plane{1-100}.

13. The nitride semiconductor light emitting device according to claim 1 , wherein said coat film has an oxygen content of 35 atomic % or less.

14. The nitride semiconductor light emitting device according to claim 1 , wherein said coat film has an oxygen content of 15 atomic % or less.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2022
From: SHARP KABUSHIKI KAISHA
To: SHARP FUKUYAMA LASER CO., LTD.
Reel/Frame 059039/0927 →