Memory systems with memory chips down and up
In some embodiments, a system includes a memory controller chip, memory chips on a first substrate, and a module connector. A first group of conductors is included to provide read data signals from at least some of the memory chips to the memory controller chip, and a second group of conductors to provide read data signals from the connector to the memory controller chip. The module connector may receive a continuity card or memory module. Other embodiments are described.
1. A system comprising:
a memory controller chip, memory chips, and a module connector each on a motherboard;
a first group of conductors to provide signals from the memory controller chip to at least some of the memory chips;
a second group of conductors to provide signals from at least some of the memory chips to the connector;
a third group of conductors to provide read data signals from at least some of the memory chips to the memory controller chip; and
a fourth group of conductors to provide read data signals from the connector to the memory controller chip,
wherein a continuity module inserted in the connector is to couple the second and fourth groups of conductors.
2. The system of claim 1 , wherein the at least some memory chips that receive the signals from the first group of conductors, the at least some memory chips that provide the signals to the second group of conductors, and the at least some memory chips that provide the read data signals to the third groups of conductors are the same memory chips.
3. The system of claim 1 , wherein the at least some memory chips that receive the signals from the first group of conductors are different memory chips than the at least some memory chips that provide the read data signals to the third group of conductors.
4. The system of claim 1 , further comprising a memory module inserted in the connector and including memory chips at least some of which are to receive signals from the second group of conductors and at least some of which are to provide the read data signals to the connector for the fourth group of conductors.
5. The system of claim 1 , further comprising a fifth group of conductors connected between the first group of conductors and the connector.
6. The system of claim 1 , further comprising a fifth group of conductors coupled between outputs of some of the memory chips and the connector.
7. The system of claim 1 , further comprising a memory module inserted in the connector and including termination circuitry to receive signals from the second group of conductors.
8. The system of claim 1 , wherein the third and fourth groups of conductors are point-to-point conductors and wherein an initial command, address data signal, and write data signal are sent to both the memory chips and the module connector in parallel.
9. The system of claim 4 , wherein the at least some memory module memory chips that receive the signals from the second group of conductors and the at least some memory module memory chips that provide the read data signals to the connector for the fourth group of conductors are the same memory chips.
10. The system of claim 4 , wherein the at least some memory module memory chips that receive the signals from the second group of conductors are different memory chips than the at least some memory module memory chips that provide the read data signals to the connector for the fourth group of conductors.
11. The system of claim 5 , further comprising a memory module inserted in the connector and including memory chips at least some of the which are to receive the signals on the fifth group of conductors and at least some of which are to provide the read data signals to the connector for the fourth group of conductors.
12. The system of claim 6 , further comprising a memory module inserted in the connector and including memory chips at least some of the which are to receive the signals on the fifth group of conductors and at least some of which are to provide the read data signals to the connector for the fourth group of conductors.