Sensor chip, detection device and method of manufacturing detection device
View Patent ↗A detection device includes an X-axis magnetic sensor, a Y-axis magnetic sensor, and a Z-axis magnetic sensor each having a sensing axis for detecting a geomagnetic azimuth and a sensor controlling semiconductor. The magnetic sensors are selected from those fabricated from the same wafer, each having the same structure, and directly mounted on the circuit substrate by directing the respective sensing axes of the magnetic sensors at different predetermined angles. Electrodes of the magnetic sensors for conducting the sensor controlling semiconductor are located in a parallel row at one side of the sensing surface.
1. A detection device with a plurality of sensor chips each having at least one sensing axis directly mounted on a circuit substrate, wherein:
the plurality of sensor chips each have a sensing surface that has a sensor element therein;
the plurality of sensor chips include a horizontally positioned sensor having the sensing axis horizontally located with respect to one surface of the circuit substrate, the horizontally positioned sensor haying a horizontal mount surface that is parallel to the sensing surface of the horizontally positioned sensor, and a cross positioned sensor having the sensing axis located at an angle crossing the circuit substrate, the cross positioned sensor having a cross mount surface that is crossing to the sensing surface of the cross position sensor, the horizontal mount surface and the cross mount surface facing the circuit substrate; and
the horizontally positioned sensor has the same structure as that of the cross positioned sensor.
2. The detection device according to claim 1 , wherein the horizontally positioned sensor and the cross positioned sensor are conducted to the circuit substrate using the same electrodes of the respective sensors at the same locations.
3. The detection device according to claim 2 , wherein the same electrodes are formed on the sensor chip in a row.
4. The detection device according to claim 3 , wherein:
at least one of the sensor chips is mounted such that one side where the electrodes provided in a row on an electrode-forming surface on which the electrodes are formed is positioned at a side of the circuit substrate; and
a wiring is formed on the circuit substrate for connecting the electrodes of the sensor chip and the circuit substrate.
5. The detection device according to claim 4 , wherein a ball-shaped corner bump is used for conductively connecting the electrodes of the sensor chip and the wiring.
6. The detection device according to claim 1 , wherein the sensor chip includes at least an X-axis magnetic sensor which allows the sensing axis to detect a geomagnetic azimuth in an X-axis direction, a Y-axis magnetic sensor which allows the sensing axis to detect a geomagnetism in a Y-axis direction, and a Z-axis magnetic sensor which allows the sensing axis to detect a geomagnetism in a Z-axis direction.
7. A method of manufacturing a detection device which mounts a plurality of sensor chips each with at least one sensing axis on a circuit substrate and each have a sensing surface that has a sensor element therein, comprising the steps of:
selecting the sensor chips from sensor chips which are fabricated from a same wafer to have same structures; and
mounting the sensor chips having the sensing axes directed at different predetermined angles, including mounting a horizontally positioned sensor having the sensing axis horizontally located with respect to one surface of the circuit substrate, the horizontally positioned sensor having a horizontal mount surface that is parallel to the sensing surface of the horizontally positioned sensor, and mounting a cross positioned sensor having the sensing axis located at an angle crossing the circuit substrate, the cross positioned sensor having a cross mount surface that is crossing to the sensing surface of the cross position sensor, the horizontal mount surface and the cross mount surface facing the circuit substrate.
8. The method of manufacturing a detection device according to claim 7 , wherein each of the respective sensing axes includes at least an axis which is horizontal with respect to the circuit substrate, and an axis which crosses the circuit substrate.
9. The method of manufacturing a detection device according to claim 7 , further comprising an inspection step for inspecting each property of the sensor chips to select and mount the sensor chips from those fabricated from the same wafer, each having the same property.
10. The detection device according to claim 1 , wherein the detection device is an accelerator sensor for detecting acceleration.
11. The detection device according to claim 1 , wherein the detection device is an angular speed sensor.