IP Library Granted Patent US 7,993,537
Granted Patent B2
US 7,993,537 · App. 11/678,098 · Granted Aug 9, 2011

Method for improving adhesion between a shape memory alloy and a polymer

Assignee: GM Global Technology Operations LLC
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Quick Facts
Patent No.
US 7,993,537
App. No.
11/678,098
Granted
Aug 9, 2011
Kind
B2
Abstract

Methods for improving adhesion between a shape memory alloy and a polymeric material include functionalizing a surface of the shape memory polymer with a phosphorous containing compound or an organosilane coupling agent. Other methods include surface texturing the shape memory alloy surface, independently or in combination with the functionalization.

Claims (33)

1. A method for improving adhesion between a shape memory alloy and a polymeric material, comprising:

contacting a surface of a shape memory alloy with a solution comprising phosphorous-containing compound; and

embedding the shape memory alloy in a polymeric material.

2. The method according to claim 1 , wherein the solution comprising the phosphorous-containing compound comprises an aqueous solution of phenylphosphonic acid.

3. The method according to claim 1 , wherein the shape memory alloy comprises a nickel titanium alloy.

4. The method according to claim 1 , further comprising texturing the shape memory alloy surface prior to contacting the surface with the solution comprising the phosphorous-containing compound.

5. The method according to claim 1 , further comprising removing an oxide/hydroxide layer from the surface of the shape memory alloy with an acidic solution and forming a new oxide/hydroxide layer on the surface of the shape memory alloy prior to contacting the surface with the solution comprising the phosphorous-containing compound.

6. The method according to claim 5 , wherein the acidic solution comprises an aqueous solution of an inorganic acid.

7. The method according to claim 1 , wherein the phosphorous-containing compound comprises a reactive functional group.

8. The method according to claim 7 , wherein the reactive functional group interacts with the polymeric material.

9. The method according to claim 1 , wherein the solution comprising the phosphorous-containing compound comprises a monomeric phosphonic acid, a monomeric phosphinic acid, a polymeric phosphonic acid, or a combination comprising at least one of the foregoing acids.

10. The method according to claim 9 , wherein the monomeric phosphonic acid is generally defined by the formula R m [PO(OH) 2 ] n , wherein R is one or more radicals having a total of 1-30 carbons; m is the number of radicals in the molecule and is in the range of 1-10; n is the number of phosphonic acid groups in the molecule and is in the range of 1-10.

11. The method according to claim 9 , wherein the monomeric phosphinic acid is generally defined by the formula R m R′ o [PO(OH)] n wherein R is one or more radicals having a total of 1-30 carbons; m is the number of R radicals in the molecule and is in the range of 1-10; R′ may be hydrogen and may be comprised of 1-30 carbon-containing radicals; o is the number of R′ radicals and is in the range of 1-10; n is the number of phosphinic acid groups in the molecule and is in the range of 1-10.

12. A method for improving adhesion between a shape memory alloy and a polymeric material, comprising:

texturing a surface of the shape memory alloy; and

embedding the shape memory alloy in a polymeric material.

13. The method of claim 12 , further comprising contacting the surface of the shape memory alloy with a solution comprising an organosilane compound prior to embedding.

14. The method of claim 12 , wherein texturing the surface comprises over-etching the surface with the oxide etchant using a mask material, electrochemical etching using a mask material, electrochemical etching using a counter electrode, machining, an arc discharge process or high intensity sonication, or a combination thereof.

15. The method of claim 12 , wherein texturing the surface comprises forming peaks and valleys and wherein embedding compromises uniformly embedding the shape memory alloy in the polymeric material.

16. The method of claim 15 , wherein the forming of the peaks and valleys in the surface of the shape memory alloy comprises masking portions corresponding to the peaks and etching unmasked portions to form the valleys.

17. The method of claim 12 , wherein texturing comprises plastically or permanently deforming at least a portion of the shape memory alloy to form a mechanical interlock with the polymeric material.

18. The method of claim 17 , wherein texturing the surface comprises over-etching the surface with an oxide etchant using a mask material, electrochemical etching using a mask material, electrochemical etching using a counter electrode, machining, an arc discharge process or high intensity sonication, or a combination thereof.

19. A method for improving adhesion between a shape memory alloy and a polymeric material, comprising:

texturing a surface of the shape memory alloy to form a textured surface;

contacting the textured surface of a shape memory alloy with a solution comprising a phosphorous-containing compound or a silane coupling agent; and

embedding the shape memory alloy in a polymeric material.

20. The method according to claim 19 , further comprising removing an oxide/hydroxide layer from the surface of the shape memory alloy with an acidic solution and forming a new oxide/hydroxide layer on the surface of the shape memory alloy prior to contacting the surface with the solution comprising the phosphorous-containing compounds.

21. The method according to claim 19 , wherein the solution comprising the phosphorous-containing compound comprises a monomeric phosphonic acid, a monomeric phosphinic acid, a polymeric phosphonic acid, or a combination comprising at least one of the foregoing acids.

22. The method according to claim 19 , wherein texturing the surface comprises forming peaks and valleys.

23. The method of claim 22 , wherein the forming of the peaks and valleys in the surface of the shape memory alloy comprises masking portions corresponding to the peaks and etching unmasked portions to form the valleys.

24. A method for embedding a shape memory alloy in a polymeric material, comprising:

contacting a surface of a shape memory alloy with a solution comprising phosphorous-containing compound; the shape memory alloy comprising at least two temperature dependent phases and configured to transform from a deformed shape to a permanent shape by a phase transformation from one to the other of the at least two temperature dependent phases; and

embedding the shape memory alloy in a polymeric material.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2014
From: WILMINGTON TRUST COMPANY
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 034185/0587 →
CHANGE OF NAME Recorded Feb 10, 2011
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 025781/0035 →
SECURITY AGREEMENT Recorded Nov 8, 2010
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: WILMINGTON TRUST COMPANY
Reel/Frame 025324/0057 →
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2010
From: UAW RETIREE MEDICAL BENEFITS TRUST
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025314/0946 →
RELEASE OF SECURITY INTEREST Recorded Nov 4, 2010
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025245/0656 →
SECURITY AGREEMENT Recorded Aug 28, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UAW RETIREE MEDICAL BENEFITS TRUST
Reel/Frame 023162/0140 →
SECURITY AGREEMENT Recorded Aug 27, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 023156/0264 →
RELEASE OF SECURITY INTEREST Recorded Aug 21, 2009
From: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023155/0663 →
RELEASE OF SECURITY INTEREST Recorded Aug 20, 2009
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023124/0563 →
SECURITY AGREEMENT Recorded Apr 16, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
Reel/Frame 022553/0540 →
SECURITY AGREEMENT Recorded Feb 4, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 022201/0448 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2007
From: HECTOR, LOUIS G., JR.; MANCE, ANDREW M.; RODGERS, WILLIAM R.; ZAVATTIERI, PABLO D.; OKONSKI, DAVID A.; SHERMAN, ELENA; BARVOSA-CARTER, WILLIAM
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 018925/0160 →
Continuity (1)
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