IP Library Granted Patent US 8,014,162
Granted Patent B2
US 8,014,162 · App. 11/905,913 · Granted Sep 6, 2011

Flexible printed circuit board

Assignee: Yamaichi Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,014,162
App. No.
11/905,913
Granted
Sep 6, 2011
Kind
B2
Abstract

A flexible printed circuit board wherein the insulative substrate 34 having a plurality of conductive layers 36 b covered with a protective layer 38 is encircled by a mesh-cloth member 32.

Claims (13)

1. A flexible printed circuit board comprising:

an insulative substrate having a plurality of ground conductive layers and a signal-transmission conductive layer formed between said ground conductive layers; and

a reticulate covering member formed of a dielectric having voids for covering said insulative substrate wherein said reticulate covering member is a tube formed to have a predetermined gap from said insulative substrate; and

wherein said insulative substrate is disposed inside of said tube.

2. The flexible printed circuit board as claimed in claim 1 , wherein said reticulate covering member is formed of a dielectric having a relative dielectric constant in a range from 2 to 4.

3. The flexible printed circuit board as claimed in claim 1 , wherein a thickness and a porosity of said reticulate covering member are from 0.3 mm to 1 mm and 50% or more, respectively.

4. A flexible printed circuit board comprising:

an insulative substrate having a plurality of ground conductive layers and a signal-transmission conductive layer formed between said ground conductive layers; and

a reticulate covering member formed of a dielectric having voids for covering said insulative substrate, and having a conductive layer on the outer circumference thereof, said conductive covering layer being electrically connected to an end of said ground conductive layer,

wherein said reticulate covering member is a tube formed to have a predetermined gap from said insulative substrate; and

wherein said insulative substrate is disposed inside of said tube.

5. The flexible printed circuit board as claimed in claim 4 , wherein said conductive covering layer is a metallic film or a conductive cloth.

6. The flexible printed circuit board as claimed in claim 4 , wherein said conductive covering layer is a radio wave absorber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2007
From: KUSAMITSU, HIDEKI
To: YAMAICHI ELECTRONICS CO., LTD.
Reel/Frame 019983/0524 →
Priority Claims (1)
JP 2006-275324 · Oct 6, 2006 · national
Continuity (1)
Related Publication 20080083559A1 · Apr 10, 2008