Methods and systems for marring fiber optic substrates
Methods and systems for marring fiber optic substrates may include rollers with abrasive surfaces that press lengths of the substrates against elongated supports, which may be tapered, during relative lengthwise movement between the rollers and supports; abrasive sheets that are vibrated against the substrates; abrasive flap wheels that are rotated to cause flexible abrasive flaps on the wheels to strike the substrates; rotating blades that cut a transverse marring pattern in the substrates; hammers having abrasive surfaces that are oscillated to strike the substrates; and water jet abrasive slurries that are directed at the substrates.
1. A method of marring a fiber optic substrate comprising the steps of supporting a length of the substrate on an elongate support, oscillating a hammer to cause an abrasive surface on the hammer to strike an area of the substrate to mar such area, and indexing the support relative to the hammer between hammer strikes to present different areas of the substrate to the hammer for marring by the hammer.
2. The method of claim 1 wherein the indexing movements of the substrate relative to the hammer are varied to provide a desired marring pattern on the substrate.
3. The method of claim 1 wherein the force applied by the hammer against different areas of the substrate is varied to provide a variable marring pattern on the substrate.
4. A method of marring a fiber optic substrate comprising the steps of supporting the substrate on an elongate support and applying a striking force to an area of the substrate to mar such area, wherein an oscillating hammer is used to apply the striking force to the substrate.
5. The method of claim 4 wherein the substrate is indexed between strikes to provide a desired marring pattern on the substrate.
6. The method of claim 5 wherein the indexing of the substrate is varied between strikes to provide a desired marring pattern on the substrate.
7. The method of claim 5 wherein a variable striking force is applied to the substrate to provide a variable marring pattern on the substrate.
8. The method of claim 4 wherein the oscillating hammer has an abrasive surface that strikes an area of the substrate to mar such area.