IP Library Granted Patent US 8,029,876
Granted Patent B2
US 8,029,876 · App. 12/491,383 · Granted Oct 4, 2011

Heat-conductive resin composition and plastic article including the same

Assignee: Cheil Industries Inc.
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Quick Facts
Patent No.
US 8,029,876
App. No.
12/491,383
Granted
Oct 4, 2011
Kind
B2
Abstract

A thermal-conductive resin composition and a plastic article are provided. The thermal-conductive resin composition comprises about 30 to about 60% by weight of a thermoplastic resin and about 40 to about 70% by weight of a thermal-conductive filler comprising about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio (length/height) of about 7,000 to about 40,000 and about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio of about 10 to about 1,000.

Claims (10)

1. A thermal-conductive resin composition comprising:

about 30 to about 60% by weight of a thermoplastic resin; and

about 40 to about 70% by weight of a thermal-conductive filler comprising about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio (length/height) of about 7,000 to about 40,000 and about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio of about 10 to about 1,000.

2. The composition according to claim 1 , wherein the thermoplastic resin comprises a polyethylene resin, a polypropylene resin, a polystyrene resin, a styrene-butadiene copolymer resin, a polyamide resin, a polycarbonate resin, a liquid crystal polymer resin, a polyvinylidene fluoride resin, polyphenylene sulfide resin, or a combination thereof.

3. The composition according to claim 1 , wherein the thermal-conductive filler comprises aluminum nitride, boron nitride, carbon black, graphite, metallic fillers, or a combination thereof.

4. The composition according to claim 1 , wherein the volume of the thermal-conductive filler is about 60% or less of the total volume of the thermal-conductive resin composition.

5. A plastic article, which is manufactured using the thermal-conductive resin composition according to claim 1 .

6. A plastic article comprising:

a thermoplastic resin substrate; and

a thermal-conductive filler dispersed in the thermoplastic resin substrate, wherein the thermal-conductive filler comprises a thermal-conductive filler with a height-to-length ratio of about 7,000 to about 40,000 and a thermal-conductive filler with a height-to-length ratio of about 10 to about 1,000.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2009
From: PARK, SUN HO; HONG, CHANG MIN
To: CHEIL INDUSTRIES INC.
Reel/Frame 022879/0385 →
Priority Claims (1)
KR 10-2006-0134980 · Dec 27, 2006 · national
Continuity (2)
Continuation In Part PCTKR2006005853 · Dec 28, 2006
Related Publication 20090264570A1 · Oct 22, 2009