ID chip and IC card
View Patent ↗The present invention provides an ID chip or an IC card in which the mechanical strength of an integrated circuit can be enhanced without suppressing a circuit scale. An ID chip or an IC card of the present invention has an integrated circuit in which a TFT (a thin film transistor) is formed from an insulated thin semiconductor film. Further, an ID chip or an IC card of the present invention has a light-emitting element and a light-receiving element each using a non-single-crystal thin film for a layer conducting photoelectric conversion. Such a light-emitting element or a light-receiving element may be formed consecutively to (integrally with) an integrated circuit or may be formed separately and attached to an integrated circuit.
1. A semiconductor device comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the light-receiving element has a layer for conducting photoelectric conversion using a non-single crystal thin film,
wherein the light-emitting element has an electroluminescent layer using a non-single crystal thin film,
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit on the same substrate.
2. A semiconductor device comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
3. A semiconductor device comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
wherein the antenna, the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
4. A semiconductor device comprising:
an integrated circuit;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the integrated circuit comprises a connection terminal, a rectification circuit configured to rectify an alternating voltage generated by an antenna, a power supply circuit configured to generate a power supply voltage by using a voltage outputted from the rectification circuit, a demodulation circuit, and a logic circuit, and
wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
5. A semiconductor device comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the light-receiving element has a layer for conducting photoelectric conversion using a non-single crystal thin film,
wherein the light-emitting element has an electroluminescent layer using a non-single crystal thin film,
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent, and
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
6. A semiconductor device comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent, and
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
7. A semiconductor device comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
wherein the antenna, the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent, and
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
8. A semiconductor device comprising:
an integrated circuit;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the integrated circuit comprises a connection terminal, a rectification circuit configured to rectify an alternating voltage generated by an antenna, a power supply circuit configured to generate a power supply voltage by using a voltage outputted from the rectification circuit, a demodulation circuit, and a logic circuit,
wherein the integrated circuit, the light-emitting element and the light-receiving element are formed integrally, and
wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent.
9. The semiconductor device according to any one of claims 5 to 8 , wherein the substrate is a plastic substrate.
10. An IC card comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
11. The IC card according to claim 10 , wherein the antenna, the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
12. An IC card comprising:
an integrated circuit;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the integrated circuit comprises a connection terminal, a rectification circuit configured to rectify an alternating voltage generated by an antenna, a power supply circuit configured to generate a power supply voltage by using a voltage outputted from the rectification circuit, a demodulation circuit, and a logic circuit, and
wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
13. An IC card comprising:
an antenna;
an integrated circuit comprising a thin film transistor;
a light-receiving element configured to receive a signal by optical communication; and
a light-emitting element configured to transmit a signal by optical communication,
wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent,
wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
14. The IC card according to claim 13 , wherein the antenna and the integrated circuit in addition to the light-emitting element and the light-receiving element are attached to the substrate with an adhesive agent.
15. The IC card according to claim 12 , wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent.
16. The IC card according to any one of claims 12 - 13 , wherein the substrate is a plastic substrate.