Integrated circuit/printed circuit board substrate structure and communications
A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.
1. A radio transceiver structure, comprising:
a substrate region operable as a wave guide for very high radio frequency (RF) signals wherein the substrate region defines a bounded volume for conducting and substantially containing the very high radio frequency signals;
a first substrate transceiver communicatively coupled to a first substrate antenna;
a second substrate transceiver communicatively coupled to a second substrate antenna;
wherein the first and second substrate transceivers are operably disposed to communicate by transmitting and receiving the very high radio frequency signals through the substrate region; and
wherein at least one of the first and second substrate antennas is placed adjacent to and is operable to radiate the very high RF signals through the substrate region.
2. The radio transceiver structure of claim 1 wherein the substrate region comprises a substantially uniformly doped dielectric region.
3. The radio transceiver structure of claim 1 wherein the first and second substrate antennas are operably sized to communicatively couple with the substrate region.
4. The radio transceiver structure of claim 1 wherein at least one of the first and second substrate antennas is formed to at least partially penetrate the substrate region and is communicatively coupled to radiate through the substrate region.
5. The radio transceiver structure of claim 1 further comprising a metal layer covering at least a portion of a surface of the substrate region.
6. The radio transceiver structure of claim 1 wherein the structure is formed on a single die and wherein the wave guide is formed within the single die.
7. The radio transceiver structure of claim 1 wherein the structure comprises a plurality of radio transceiver integrated circuits supported by a printed circuit board wherein the wave guide is formed within a radio transceiver integrated circuit or within the printed circuit board.
8. An apparatus, comprising:
a supporting substrate including electronic circuit components;
a guiding structure having a fabricated composition for guiding radio frequency electromagnetic waves wherein the guiding structure is formed within the supporting substrate;
a first substrate transceiver communicatively coupled to a first substrate antenna;
a second substrate transceiver communicatively coupled to a second substrate antenna;
wherein the first and second substrate antennas are operably disposed to communicate by transmitting and receiving radio frequency communication signals through the guiding structure of the supporting substrate; and
wherein a guiding structure is formed to guide very high RF signals in a hub-and-spoke configuration between a first substrate transceiver and at least two second substrate transceivers.
9. The apparatus of claim 8 wherein at least one of the first and second substrate antennas is placed adjacent to and is communicatively coupled to radiate through the guiding structure of the supporting substrate.
10. The apparatus of claim 8 wherein at least one of the first and second substrate antennas is formed to at least partially penetrate the guiding structure of the supporting substrate and is communicatively coupled to radiate through the guiding structure of the supporting substrate.
11. The apparatus of claim 8 further comprising a metal layer covering at least a portion of a surface of the guiding structure of the supporting substrate.
12. The apparatus of claim 8 wherein the guiding structure of the supporting substrate comprises a semiconductor dielectric material.
13. The apparatus of claim 8 wherein the guiding structure of the supporting substrate is formed within a die of an integrated circuit.
14. The apparatus of claim 8 wherein the guiding structure of the supporting substrate is formed within a supporting board that is operable to house an integrated circuit.
15. The apparatus of claim 8 wherein at least one of the first and second substrate transceivers is formed substantially within a dielectric substrate and is operably disposed to transmit and receive very high RF signals through the guiding structure of the supporting substrate.
16. The apparatus of claim 8 wherein the supporting substrate further includes a plurality of integrated circuit modules, at least two of which are operable to communicate by way of substrate transceivers through the guiding structure of the supporting substrate.
17. An apparatus, comprising:
a supporting substrate including electronic circuit components;
a guiding structure having a fabricated composition for guiding radio frequency electromagnetic waves wherein the guiding structure is formed within the supporting substrate;
a first substrate transceiver communicatively coupled to a first substrate antenna;
a second substrate transceiver communicatively coupled to a second substrate antenna;
wherein the first and second substrate antennas are operably disposed to communicate by transmitting and receiving radio frequency communication signals through the guiding structure of the supporting substrate; and
wherein a first guiding structure, operable to guide very high RF signals between a first pair of substrate transceivers, partially overlaps a second guiding structure operable to guide RF communication signals between a second pair of substrate transceivers.
18. A method for communications within a supporting substrate having a wave guide formed within the supporting substrate, the method comprising:
generating a high frequency radio frequency (RF) signal by a first substrate transceiver, wherein the high frequency RF signal is characterized by a frequency that is greater than or equal to 10 GHz; and
transmitting the high frequency RF signal through the wave guide formed within the supporting substrate from a first substrate antenna of the first substrate transceiver for reception by a second substrate antenna of a second transceiver.
19. The method of claim 18 further including transmitting the high frequency RF signal from the first substrate antenna of the first substrate transceiver wherein the first substrate antenna is communicatively coupled to transmit the high frequency RF signal through the wave guide.
20. The method of claim 19 further including:
receiving the high frequency RF signal by the second substrate antenna communicatively coupled to receive the high frequency RF signal transmitted through the wave guide.
21. A method for communications within a supporting substrate having a wave guide formed within the supporting substrate, the method comprising:
generating a high frequency radio frequency (RF) signal by a first substrate transceiver; and
transmitting the high frequency RF signal through the wave guide formed within the supporting substrate from a first substrate antenna of the first substrate transceiver for reception by a second substrate antenna of a second transceiver, wherein at least one of the first and second substrate antennas is characterized by an antenna length that is less than or equal to 15 mm.
22. A method for communications within a supporting substrate having a wave guide formed within the supporting substrate, the method comprising:
generating a high frequency radio frequency (RF) signal by a first substrate transceiver;
transmitting the high frequency RF signal through the wave guide formed within the supporting substrate from a first substrate antenna of the first substrate transceiver for reception by a second substrate antenna of a second transceiver; and
wherein the high frequency RF signal is transmitted at a very low power level wherein the very low power level is one that is less than a required power level for over-the-air transmissions to remote devices.