Probe card with segmented substrate
A probe card for testing of semiconductor dice is provided. The probe card includes a mounting plate and a plurality of substrate segments supported by the mounting plate.
1. A probe card comprising:
a mounting plate; and
a plurality of substrate segments supported by the mounting plate via a frame that includes one or more biasing members for biasing each of the plurality of substrate segments into at least a first position relative to the frame and to elastically accommodate thermal expansion and contraction of each of the plurality of substrate segments relative to the frame wherein the biasing member includes an epoxy based material.
2. The probe card of claim 1 , wherein the biasing member includes a spring element.
3. The probe card of claim 1 , wherein the frame includes one or more notches configured to receive an edge portion of at least one of the plurality of substrate segments.
4. The probe card of claim 1 further comprising a printed circuit board, the mounting plate being positioned between the printed circuit board and the plurality of substrate segments.
5. The probe card of claim 1 wherein the mounting plate is a printed circuit board.
6. The probe card of claim 1 further comprising an interposer positioned between the mounting plate and the substrate segments.
7. The probe card of claim 1 wherein the plurality of substrate segments includes a first substrate segment and a second substrate segment, wherein a gap defined between (1) a first group of probe elements supported by the first substrate segment and (2) a second group of probe elements supported by the second substrate segment is substantially equal to another gap defined between (3) the first group of probe elements supported by the first substrate segment and (4) a third group of probe elements supported by the first substrate segment.
8. A probe card comprising:
a mounting plate; and
a plurality of substrate segments supported by the mounting plate via a frame that includes one or more biasing members for biasing each of the plurality of substrate segments into at least a first position relative to the frame and to elastically accommodate thermal expansion and contraction of each of the plurality of substrate segments relative to the frame wherein the frame is fabricated from a material having a coefficient of thermal expansion below about 2.510 −6 inch per inch per Fahrenheit degree.
9. The probe card of claim 8 , wherein the frame includes one or more notches configured to receive an edge portion of at least one of the plurality of substrate segments.
10. The probe card of claim 8 , wherein the plurality of substrate segments includes a first substrate segment and a second substrate segment, wherein a gap defined between (1) a first group of probe elements supported by the first substrate segment and (2) a second group of probe elements supported by the second substrate segment is substantially equal to another gap defined between (3) the first group of probe elements supported by the first substrate segment and (4) a third group of probe elements supported by the first substrate segment.
11. A probe card comprising:
a printed circuit board including a plurality of conductive pads; and
a probe substrate supporting a plurality of probe elements, the probe elements being conductively coupled to respective ones of the plurality of conductive pads, the probe substrate including a plurality of substrate segments supported by the printed circuit board via a frame that includes one or more biasing members for biasing each of the plurality of substrate segments into at least a first position relative to the frame and to elastically accommodate thermal expansion and contraction of each of the plurality of substrate segments relative to the frame wherein the biasing member includes an epoxy based material.
12. The probe card of claim 11 , wherein the biasing member includes a spring element.
13. The probe card of claim 11 , wherein the frame includes one or more notches configured to receive an edge portion of at least one of the plurality of substrate segments.
14. The probe card of claim 11 , further comprising a mounting plate positioned between the printed circuit board and the plurality of substrate segments.
15. The probe card of claim 11 , further comprising an interposer positioned between the printed circuit board and the plurality of substrate segments.
16. The probe card of claim 11 , wherein the plurality of substrate segments includes a first substrate segment and a second substrate segment, wherein a gap defined between (1) a first group of probe elements supported by the first substrate segment and (2) a second group of probe elements supported by the second substrate segment is substantially equal to another gap defined between (3) the first group of probe elements supported by the first substrate segment and (4) a third group of probe elements supported by the first substrate segment.
17. A probe card comprising:
a printed circuit board including a plurality of conductive pads; and
a probe substrate supporting a plurality of probe elements, the probe elements being conductively coupled to respective ones of the plurality of conductive pads, the probe substrate including a plurality of substrate segments supported by the printed circuit board via a frame that includes one or more biasing members for biasing each of the plurality of substrate segments into at least a first position relative to the frame and to elastically accommodate thermal expansion and contraction of each of the plurality of substrate segments relative to the frame wherein the frame is fabricated from a material having a coefficient of thermal expansion below about 2.5*10 −6 inch per inch per Fahrenheit degree.
18. The probe card of claim 17 , wherein the frame includes one or more notches configured to receive an edge portion of at least one of the plurality of substrate segments.
19. The probe card of claim 17 , wherein the plurality of substrate segments includes a first substrate segment and a second substrate segment, wherein a gap defined between (1) a first group of probe elements supported by the first substrate segment and (2) a second group of probe elements supported by the second substrate segment is substantially equal to another gap defined between (3) the first group of probe elements supported by the first substrate segment and (4) a third group of probe elements supported by the first substrate segment.