Carbon nanotube based interposer
In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.
1. An interposer for a board interconnect system, the interposer comprising:
a frame for receiving a substrate, the substrate including a top side, a bottom side, and a conductive interface extending through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough; and
at least one interconnect including a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.
2. The interposer of claim 1 wherein the plurality of CNTs contact the conductive interface at the bottom side of the substrate.
3. The interposer of claim 1 wherein the at least one interconnect further includes a copper slug embedded within the frame for supporting the plurality of CNTs on a top end of the slug and for supporting the plurality of CNTs on a bottom end of the slug.
4. The interposer of claim 3 wherein the plurality of CNTs extend away from the top end of the slug to contact the conductive interface of the substrate and the plurality of CNTs extend away from the bottom end of the slug to contact the conductive arrangement of the circuit board.
5. The interposer of claim 4 wherein the plurality of CNTs extend away from the top end of the slug to contact the conductive interface at the bottom side of the substrate.
6. A board interconnect system comprising:
an electrical device for transmitting an electrical signal;
a circuit board for receiving the electrical signal;
a substrate including a top side, a bottom side, and a conductive interface extending through the top side and the bottom side for delivering the electrical signal from the electrical device to the circuit board; and
an interposer including:
a frame for receiving the substrate; and
at least one interconnect including a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of the circuit board.
7. The system of claim 6 wherein the plurality of CNTs contact the conductive interface at the bottom side of the substrate.
8. The system of claim 6 wherein the at least one interconnect further includes a copper slug embedded within the frame for supporting the plurality of CNTs on a top end thereof and for supporting the plurality of CNTs on a bottom end thereof.
9. The system of claim 8 wherein the plurality of CNTs extend away from the top end of the slug to contact the conductive interface of the substrate and the plurality of CNTs extend away from the bottom end of the slug to contact the conductive arrangement of the circuit board.
10. The system of claim 9 wherein the plurality of CNTs extend away from the top end of the slug to contact the conductive interface at the bottom side of the substrate.
11. A board interconnect system comprising:
an electrical device for transmitting an electrical signal;
a circuit board including a conductive arrangement for receiving the electrical signal;
a substrate including a top side, a bottom side, and a conductive interface extending through the top side and the bottom side for delivering the electrical signal from the electrical device positioned on the top side therethrough; and
an interposer including:
a frame for receiving the substrate; and
at least one interconnect having a plurality of carbon nanotubes (CNTs) in electrical communication with the conductive interface of the substrate to provide the electrical signal to the conductive arrangement of the circuit board.
12. The system of claim 11 wherein the plurality of CNTs contact the conductive interface at the bottom side of the substrate.
13. The system of claim 11 wherein the at least one interconnect further includes a copper slug embedded within the frame for supporting the plurality of CNTs on a top end thereof and for supporting the plurality of CNTs on a bottom end thereof.
14. The system of claim 13 wherein the plurality of CNTs extend away from the top end of the slug to contact the conductive interface of the substrate and the plurality of CNTs extend away from the bottom end of the slug to contact the conductive arrangement of the circuit board.
15. The system of claim 14 wherein the plurality of CNTs extend away from the top end of the slug to contact the conductive interface at the bottom side of the substrate.
16. The system of claim 11 wherein the frame includes the plurality of CNTs being positioned therein.