Impedance tuning for circuit board signal path surface pad structures
View Patent ↗The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
1. A circuit board comprising:
a surface conductive layer comprising a first surface pad;
an embedded conductive reference plane layer, separated from the surface conductive layer by a dielectric layer, the reference plane layer comprising a first reference pad underlying the first surface pad, the first reference pad separated from adjacent portions of the reference plane layer by at least one clearance, and connected to adjacent portions of the reference plane layer through at least one conductive spoke; and
an embedded conductive signal layer, separated from the embedded conductive reference plane layer by a dielectric layer, the embedded conductive signal layer comprising a differential trace pair passing under the first reference pad.
2. The circuit board of claim 1 , wherein the at least one conductive spoke comprises at least two conductive spokes arranged in a configuration such that one of the at least two conductive spokes overlies one trace of the differential trace pair and another of the at least two conductive spokes overlies the other trace of the differential trace pair.
3. The circuit board of claim 2 , wherein the at least two conductive spokes comprises at least four conductive spokes, arranged in a configuration such that a third one of the at least four conductive spokes overlies one trace of the differential trace pair and a fourth one of the at least four conductive spokes overlies the other trace of the differential trace pair.
4. The circuit board of claim 2 , wherein each of the spokes overlying a differential pair trace has an average width at least 110% of the width of differential pair traces.
5. The circuit board of claim 1 , wherein at least one of the first reference pad and the adjacent portion of the reference plane layer is notched, the at least one conductive spoke routed into the notch to connect the first reference pad to an adjacent portion of the reference plane layer.
6. The circuit board of claim 1 , wherein the first surface pad comprises an interior reticulated pattern in which the conductive material of the surface conductive layer is absent.
7. The circuit board of claim 6 , wherein the interior reticulated pattern is at least partially filled with a dielectric material.
8. The circuit board of claim 7 , wherein the interior reticulated pattern is aligned with an intended orientation of a component to the first surface pad.
9. The circuit board of claim 8 , further comprising the component, flow soldered to the first surface pad in the intended orientation.
10. The circuit board of claim 8 , wherein the component has two possible alignments, wherein the interior reticulation pattern comprises the intersection of two individual reticulation patterns, one individual reticulation pattern for each possible alignment.
11. The circuit board of claim 1 , wherein the first surface pad is one of a plurality of proximate surface pads used to select a configuration option for the board by attaching a component between first and second ones of the proximate surface pads, each pad of the plurality of proximate surface pads aligned with a corresponding one of a plurality of proximate reference pad, each spoked and arranged similar to the first reference pad, on the reference plane layer.