Method for forming antenna structure
A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.
1. A method for forming an antenna structure, comprising:
providing a non-conductive frame and disposing a plating resist material on the non-conductive frame;
removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking;
forming a medium layer on the roughened surface, wherein the medium layer comprises Pd;
removing the plating resist material on the non-conductive frame; and
forming a metal layer on the medium layer.
2. The method as claimed in claim 1 , wherein the metal layer is formed on the medium layer by electroless deposition.
3. The method as claimed in claim 1 , wherein the medium layer comprises Pb/Sn colloid or AgNO 3 .
4. The method as claimed in claim 1 , wherein the plating resist material comprises resin.
5. The method as claimed in claim 1 , wherein the non-conductive frame is immersed in the plating resist material to form a resist layer on the non-conductive frame.
6. The method as claimed in claim 1 , wherein the plating resist material is sprayed on the non-conductive frame to form a resist layer on the non-conductive frame.
7. The method as claimed in claim 1 , wherein the plating resist material is daubed on the non-conductive frame to form a resist layer on the non-conductive frame.
8. The method as claimed in claim 1 , wherein the metal layer comprises Cu.
9. The method as claimed in claim 1 , wherein the metal layer comprises Ni.
10. The method as claimed in claim 1 , wherein the non-conductive frame comprises plastic material integrally formed by injection molding.
11. The method as claimed in claim 1 , wherein the plating resist material is removed after forming the metal layer on the medium layer.
12. The method as claimed in claim 1 , wherein the plating resist material is removed before forming the metal layer on the medium layer.