IP Library Granted Patent US 8,202,808
Granted Patent B2
US 8,202,808 · App. 12/793,611 · Granted Jun 19, 2012

Methods of forming strontium titanate films

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Quick Facts
Patent No.
US 8,202,808
App. No.
12/793,611
Granted
Jun 19, 2012
Kind
B2
Abstract

Embodiments of the current invention include methods of forming a strontium titanate (SrTiO 3 ) film using atomic layer deposition (ALD). More particularly, the method includes forming a plurality of titanium oxide (TiO 2 ) unit films using ALD and forming a plurality of strontium oxide (SrO) unit films using ALD. The combined thickness of the TiO 2 and SrO unit films is less than approximately 5 angstroms. The TiO 2 and SrO units films are then annealed to form a strontium titanate layer.

Claims (21)

1. A method for forming a strontium titanate film, comprising:

a. applying between 50 and 200 pre-saturation pulses without a pulse of an oxidant between the pulses of a Sr-precursor to a substrate, wherein the substrate comprises a conductive layer;

b. forming a Sr-containing and Ti-containing film on the substrate after applying the pulses by

i. forming an SrO film from one or more SrO unit films;

ii. forming a TiO 2 film from one or more TiO 2 unit films over the previously formed SrO film;

iii. forming one or more SrO unit films over the previously formed TiO 2 film if the combined total thickness of all previously formed SrO films and all previously formed TiO 2 films has not reached a desired value;

iv. forming one or more TiO 2 unit films over the previously formed SrO film if the combined total thickness of all previously formed SrO films and all previously formed TiO 2 films has not reached a desired value;

v. repeating steps iii) and iv); and

c. annealing the Sr-containing and Ti-containing film.

2. The method of claim 1 wherein the conductive layer comprises one of titanium nitride, platinum, iridium, iridium oxide, tungsten, tungsten oxide, molybdenum, molybdenum oxide, ruthenium, or ruthenium oxide.

3. The method of claim 1 wherein an oxygen containing source is one of ozone, oxygen, plasma activated oxygen, or water.

4. The method of claim 3 wherein the oxygen containing source is ozone.

5. The method of claim 1 wherein a combined total thickness of a single SrO unit film plus a single TiO 2 unit film is between 2 angstroms and 10 angstroms.

6. The method of claim 5 wherein a combined total thickness of a single SrO unit film plus a single TiO 2 unit film is between 2 angstroms and 5 angstroms.

7. The method of claim 6 wherein a combined total thickness of a single SrO unit film plus a single TiO 2 unit film is between 3 angstroms and 4 angstroms.

8. The method of claim 1 wherein the combined total thickness of the SrO film plus the TiO 2 film is between 10 nm and 20 nm.

9. The method of claim 8 wherein the combined total thickness of the SrO film plus the TiO 2 film is 15 nm.

10. The method of claim 1 wherein the ratio of the number of SrO unit films to the number of TiO 2 unit films is 3:2.

11. The method of claim 1 wherein the annealing step is performed at a temperature between 550 C and 700 C.

12. The method of claim 11 wherein the annealing step is performed at a temperature between 600 C and 650 C.

13. The method of claim 1 wherein the annealing step is performed in an atmosphere of one of nitrogen, oxygen, or inert gas.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2011
From: MATZ, LAURA M.; LEI, XINJIAN; KIM, MOO-SUNG; BUCHANAN, IAIN; RUI, XIANGXIN; SHANKER, SUNIL; FUCHIGAMI, NOBI
To: INTERMOLECULAR, INC.
Reel/Frame 026614/0364 →