Low application temperature hot melt adhesive composition and articles including the same
View Patent ↗A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.
1. A hot melt adhesive composition comprising:
thermoplastic polymer comprising ethylene copolymer selected from the group consisting of ethylene vinyl acetate, ethylene n-butyl acrylate, ethylene methyl-methacrylate, ethylene ethyl methacrylate, ethylene 2-ethylhexyl acrylate, ethylene methacrylate, ethylene ethylacrylate, and ethylene acrylic acid;
a first tackifying agent comprising phenol-modified aromatic petroleum hydrocarbon resin; and
a first wax,
wherein the composition is free of a vegetable wax and exhibits a viscosity of no greater than about 6000 centipoise at 300° F.
2. The hot melt adhesive composition of claim 1 , wherein the composition exhibits a viscosity no greater than about 3500 centipoise at 300° F.
3. The hot melt adhesive composition of claim 1 , wherein the composition exhibits at least 40% fiber tear when tested according to the Fiber Tear test method in which the application temperature is no greater than about 300° F. and the test temperature is 120° F.
4. The hot melt adhesive composition of claim 1 further comprising a second tackifying agent different from the first tackifying agent.
5. The hot melt adhesive composition of claim 4 , wherein the second tackifying agent comprises at least one of rosin ester, rosin acid, styrenated terpene, terpene-phenolic resin, aliphatic hydrocarbon resin, aromatic-modified aliphatic resin, aromatic hydrocarbon resin, α-methyl styrene resin, hydrogenated hydrocarbon resin and aromatically-modified hydrocarbon resin.
6. The hot melt adhesive composition of claim 1 , wherein the first wax is selected from the group consisting of paraffin waxes, Fischer-Tropsch waxes, and combinations thereof.
7. The hot melt adhesive composition of claim 1 , wherein the first wax has a needle penetration of no greater that 27 dmm at 25° C.
8. The hot melt adhesive composition of claim 1 further comprising a second wax different from the first wax.
9. The hot melt adhesive composition of claim 8 , wherein the second wax is selected from a group consisting of waxes comprising polyethylene, Fischer-Tropsch waxes, microcrystalline waxes, and combinations thereof.
10. The hot melt adhesive composition of claim 1 , wherein the composition exhibits a peel adhesion failure temperature of at least 122° F.
11. The hot melt adhesive composition of claim 1 , wherein the ethylene-copolymer comprises ethylene vinyl acetate.
12. The hot melt adhesive composition of claim 1 , wherein the ethylene-copolymer comprises at least one of ethylene n-butyl acrylate, ethylene methyl-methacrylate, ethylene ethyl methacrylate, ethylene 2-ethylhexyl acrylate, ethylene methacrylate, ethylene ethylacrylate, and ethylene acrylic acid.
13. The hot melt adhesive composition of claim 4 , wherein the composition, when heated to a temperature of no more than about 300° F., is clear as determined by the unaided eye.
14. A method of making a construction, the method comprising:
applying the hot melt adhesive composition of claim 1 on a surface of a first substrate; and
contacting the applied adhesive composition with a second substrate such that the first substrate is bonded to the second through the adhesive composition and the adhesive composition exhibits a fiber tearing bond to the first and second substrates.
15. The method of claim 14 , wherein at least one of the first or second substrates comprises at least one of paperboard, corrugated paperboard, cardboard, and coated cardboard.
16. The method of claim 14 , wherein at least one of the first or second substrates comprises at least one of paper and coverstock.
17. A method of packaging an article, the method comprising:
filling a package with an article; and
applying the hot melt adhesive composition of claim 1 on a first surface of the package, the package being selected from a group consisting of a case, carton and tray.
18. The method of claim 14 , further comprising contacting the applied hot melt adhesive composition with a second surface to achieve at least one of forming a packaging construction and sealing a packaging construction.
19. A packaging construction made by the method of claim 14 in which the packaging construction is selected from a group consisting of a bag, box, carton, case and tray.
20. A hot melt adhesive composition comprising:
thermoplastic polymer comprising ethylene copolymer selected from the group consisting of ethylene vinyl acetate, ethylene n-butyl acrylate, ethylene methyl-methacrylate, ethylene ethyl methacrylate, ethylene 2-ethylhexyl acrylate, ethylene methacrylate, ethylene ethylacrylate, and ethylene acrylic acid;
a first tackifying agent comprising phenol-modified aromatic petroleum hydrocarbon resin; and
a first wax,
wherein the composition is free of a vegetable wax, exhibits a peel adhesion failure temperature of at least 122° F. and exhibits a viscosity of no greater than about 6000 centipoise at 300° F.