Connecting film, and joined structure and method for producing the same
View Patent ↗To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle.
1. A connecting film comprising:
an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle,
wherein the color-erasing pigment contains a compound represented by General Formula (1) below:
where R1 and R2 each denote any one of a hydrogen atom, an alkyl group and an aryl group, Y denotes any one of a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a dimethylamino group, a diethylamino group, a methoxy group and an ethoxy group, Z − denotes a counteranion, and n denotes an integer of 0 to 3,
wherein Z denotes any one of ClO 4 , BF 4 , CF 3 SO 3 , a compound represented by General Formula (24) below, a compound represented by General Formula (25) below, a compound represented by General Formula (4) below, a compound represented by Structural Formula (1) below, and a compound represented by Structural Formula (2) below:
wherein R denotes one of a hydrogen atom and a fluorine atom,
wherein the connecting film is an anisotropic conductive film.
2. The connecting film according to claim 1 , wherein the curable organic resin is an acrylic resin, and the curing agent is a radical curing agent.
3. The connecting film according to claim 1 , wherein the curable organic resin is an epoxy resin, and the curing agent is a cationic curing agent.
4. The connecting film according to claim 1 , wherein the color-erasing pigment is erased by heat.