IP Library Granted Patent US 8,325,950
Granted Patent B2
US 8,325,950 · App. 12/855,544 · Granted Dec 4, 2012

Silicon condenser microphone

Assignees: AAC Acoustic Technologies (Shenzhen) Co., Ltd.; American Audio Components Inc.
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Quick Facts
Patent No.
US 8,325,950
App. No.
12/855,544
Granted
Dec 4, 2012
Kind
B2
Abstract

Disclosed is a silicon condenser microphone including a backplate having a plurality of perforations therethrough, a diaphragm opposed from the backplate for forming a capacitor. The diaphragm includes a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate. The first part is connected to the ground and the second part is connected to a bias voltage.

Claims (7)

1. A silicon condenser microphone, comprising: a silicon base; a back plate located above the base and a plurality of perforations; a diaphragm opposed from the back plate, the diaphragm comprising an inner vibrating part and an outer part surrounding the inner part; a capacitor formed by the back plate and the diaphragm; a gap formed between the inner vibrating part and the outer part; wherein the inner vibrating part is provided with a first electrode pad electrically connected to a bias voltage, and the outer part is provided with a second electrode pad connected to the ground; and wherein the outer part of the diaphragm, while continuously connected, defines a plurality of recesses, and the inner vibrating part correspondingly defines a plurality of supporting arms partially accommodated in the recesses.

2. The silicon condenser microphone as described in claim 1 , wherein the outer part of the diaphragm further defines a channel and the first electrode pad extends through the channel.

3. The silicon condenser microphone as described in claim 1 , wherein the first electrode pad extends along a direction opposite to a direction along which the second electrode pad extends.

4. A silicon condenser microphone, comprising: a back plate having a plurality of perforations there through; a diaphragm opposed from the back plate for forming a capacitor, the diaphragm including a first part and a second part received in the first part, the second part being capable of vibrating relative to the back plate; a gap formed between the first part and the second part; wherein the first part is connected to the ground and the second part is connected to a bias voltage; and wherein the first part of the diaphragm, while continuously connected, defines a plurality of recesses and the second part defines a plurality of supporting arms partially received in the recesses.

5. The silicon condenser microphone as described in claim 4 , wherein the first part defines an electrode pad extending along a first direction, and the second part defines another electrode pad extending along a second direction, the first direction being opposite to the second direction.

6. The silicon condenser microphone as described in claim 5 , wherein the first part of the diaphragm defines a plurality of recesses, and the second correspondingly defines a plurality of supporting arms partially received in the recesses.

7. The silicon condenser microphone as described in claim 6 , wherein the first part of the diaphragm further defines a channel and the electrode pad of the second part extends through the channel.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2017
From: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
To: AAC TECHNOLOGIES PTE. LTD.
Reel/Frame 042319/0113 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 12, 2010
From: LI, HAI-FENG; ZHANG, RUI
To: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.; AMERICAN AUDIO COMPONENTS INC.
Reel/Frame 024831/0515 →
Priority Claims (1)
CN 2010 1 0119951 · Mar 8, 2010 · national
Continuity (1)
Related Publication 20110216922A1 · Sep 8, 2011