IP Library Granted Patent US 8,339,748
Granted Patent B2
US 8,339,748 · App. 12/826,550 · Granted Dec 25, 2012

Suspension assembly having a microactuator bonded to a flexure

Assignee: Western Digital Technologies, Inc.
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Quick Facts
Patent No.
US 8,339,748
App. No.
12/826,550
Granted
Dec 25, 2012
Kind
B2
Abstract

Disclosed is a suspension assembly for a disk drive that includes: a mounting plate having a top-side and a bottom-side; a microactuator mounting structure formed in the mounting plate; a microactuator mounted in the microactuator mounting structure in which the microactuator has a top-side and a bottom-side; and a flexure attached to the bottom-side of the of mounting plate and the microactuator. The flexure includes a pad layer and a through-hole, in which the through-hole extends through the pad layer. An epoxy on the pad layer bonds widely to the microactuator and extends through the through-hole.

Claims (32)

1. A disk drive comprising:

a spindle attached to a disk drive base;

a disk mounted on the spindle;

a coarse actuator attached to the disk drive base, the coarse actuator including an actuator arm; and

a suspension assembly attached to the actuator arm, the suspension assembly including:

a mounting plate having a top-side and a bottom-side;

a microactuator mounting structure formed in the mounting plate;

a microactuator mounted in the microactuator mounting structure to position a read head, the microactuator having a top-side and a bottom-side;

a flexure attached to the bottom-side of the of mounting plate, the flexure including a pad layer and a through-hole extending through the pad layer, wherein epoxy on the pad layer bonds widely to the microactuator and extends through the through-hole; and

a via, the via to connect a copper (Cu) layer of the flexure to a metal layer of the flexure.

2. The disk drive of claim 1 further comprising a plurality of through-holes, each through-hole extending through the pad layer.

3. The disk drive of claim 1 wherein the microactuator is a piezoelectric microactuator.

4. The disk drive of claim 3 wherein the piezoelectric microactuator includes a gold layer to which the epoxy is bonded.

5. The disk drive of claim 1 wherein the epoxy includes silver (Ag).

6. The disk drive of claim 1 wherein the pad layer of the flexure includes an insulator layer and a metal layer.

7. The disk drive of claim 1 wherein the pad layer of the flexure includes a copper (Cu) layer with gold (Au) coating.

8. The disk drive of claim 7 wherein the copper layer of the flexure further comprises a ground trace and a plurality of other traces.

9. The disk drive of claim 1 wherein the metal layer of the flexure is stainless steel.

10. A suspension assembly comprising:

a mounting plate having a top-side and a bottom-side;

a microactuator mounting structure formed in the mounting plate;

a microactuator mounted in the microactuator mounting structure to position a read head, the microactuator having a top-side and a bottom-side;

a flexure attached to the bottom-side of the of mounting plate, the flexure including a pad layer and a through-hole extending through the pad layer, wherein epoxy on the pad layer bonds widely to the microactuator and extends through the through-hole; and

a via, the via to connect a copper (Cu) layer of the flexure to a metal layer of the flexure.

11. The suspension assembly of claim 10 further comprising a plurality of through-holes, each through-hole extending through the pad layer.

12. The suspension assembly of claim 10 wherein the microactuator is a piezoelectric microactuator.

13. The suspension assembly of claim 12 wherein the piezoelectric microactuator includes a gold layer to which the epoxy is bonded.

14. The suspension assembly of claim 10 wherein the epoxy includes silver (Ag).

15. The suspension assembly of claim 10 wherein the pad layer of the flexure includes an insulator layer and a metal layer.

16. The suspension assembly of claim 10 wherein the pad layer of the flexure includes a copper (Cu) layer with gold (Au) coating.

17. The suspension assembly of claim 16 wherein the copper layer of the flexure further comprises a ground trace and a plurality of other traces.

18. The suspension assembly of claim 10 wherein the metal layer of the flexure is stainless steel.

Assignments (8)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038744 FRAME 0481 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0556 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 045501/0714 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0481 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0281 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038722/0229 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2010
From: SHUM, WING C.; LIU, YANNING; SCURA, JOHN E.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 024775/0551 →
Continuity (1)
Related Publication 20110317309A1 · Dec 29, 2011