IP Library Granted Patent US 8,359,871
Granted Patent B2
US 8,359,871 · App. 12/658,541 · Granted Jan 29, 2013

Temperature control device

Inventors: Mark C. Woods (Richardson, TX); Leonard J. Recine (Plano, TX); James L. Bierschenk (Rowlett, TX); Overton L. Parish (Frisco, TX)
Assignee: Marlow Industries, Inc.
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Quick Facts
Patent No.
US 8,359,871
App. No.
12/658,541
Granted
Jan 29, 2013
Kind
B2
Abstract

A temperature control device includes a thermoelectric device and a first sink. The thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects which are coupled between an interior surface of a first plate and an interior surface of a second plate. The first sink has a flat bottom and a plurality of generally parallel fins extending out of the flat bottom. Also, the flat bottom is coupled to an exterior surface of the first plate by a coupling media that includes a resilient and thermally-conductive pad.

Claims (40)

1. A temperature control device, comprising a thermoelectric device and a first sink, wherein:

the thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects, the plurality of thermoelectric elements coupled between an interior surface of a first plate and an interior surface of a second plate;

the first sink comprises a flat bottom and a plurality of generally parallel fins extending out of the flat bottom;

the plurality of generally parallel fins comprises a plurality of flanges, each of the plurality of flanges disposed between the top and bottom of a respective fin of the plurality of generally parallel fins; and

the plurality of flanges configured to sequentially connect adjacent fins of the plurality of generally parallel fins.

2. The temperature control device of claim 1 , wherein:

the flat bottom is coupled to an exterior surface of the first plate by a coupling media comprising a resilient and thermally-conductive pad; and

the flat bottom comprises a plurality of notches traversing the flat bottom perpendicular to the plurality of fins.

3. The temperature control device of claim 2 , wherein the flat bottom is soldered to a first side of the resilient and thermally-conductive pad and the exterior surface of the plate is soldered to a second side of the resilient and thermally-conductive pad, the first side disposed opposite the second side.

4. The temperature control device of claim 2 , wherein the sink consists of a contiguous sheet of metal having a plurality of consecutive folds.

5. The temperature control device of claim 1 , further comprising a hydrophobic coating applied to the plurality of fins, the hydrophobic coating adapted to inhibit moisture from accumulating on the plurality of fins.

6. The temperature control device of claim 1 , wherein one or more of the plurality of fins comprises a perforation surrounded by a generally frusto-conically shaped rim nested inside another generally frusto-conically shaped rim surrounding a perforation in an adjacent fin of the plurality of fins.

7. The temperature control device of claim 1 , wherein one end of the plurality of fins comprises a plurality of lateral folds and the flat bottom comprises an aggregation of the lateral folds.

8. The temperature control device of claim 1 , further comprising a switch operable to electrically short the thermoelectric device during a passive mode of operation.

9. The temperature control device of claim 1 , wherein:

the plurality of electrical interconnects cover substantially all of the surface area of the interior surfaces of the first and second plates; and

the plurality of thermoelectric elements cover a minority of the surface area of the plurality of electrical interconnects.

10. The temperature control device of claim 1 , wherein a thickness of the flat bottom is equal to a thickness of a fin of the plurality of fins.

11. A temperature control device, comprising a thermoelectric device and a first sink, wherein:

the thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects, the plurality of thermoelectric elements coupled between an interior surface of a first plate and an interior surface of a second plate;

the first sink comprises a flat bottom and a plurality of generally parallel fins extending out of the flat bottom;

the plurality of generally parallel fins comprises a plurality of flanges, each of the plurality of flanges disposed between the top and bottom of a respective fin of the plurality of generally parallel fins;

the plurality of flanges configured to sequentially connect adjacent fins of the plurality of generally parallel fins;

the flat bottom is coupled to an exterior surface of the first plate by a coupling media; and

the first sink comprises a hydrophobic coating applied to the plurality of fins, the hydrophobic coating adapted to inhibit moisture from accumulating on the plurality of fins.

12. The temperature control device of claim 11 , wherein the flat bottom includes a plurality of notches traversing the flat bottom perpendicular to the plurality of fins.

13. The temperature control device of claim 11 , wherein the sink consists of a contiguous sheet of metal having a plurality of consecutive folds.

14. The temperature control device of claim 13 , wherein the coupling media comprising a resilient and thermally-conductive pad.

15. The temperature control device of claim 14 , wherein the flat bottom is soldered to a first side of the resilient and thermally-conductive pad and the exterior surface of the plate is soldered to a second side of the resilient and thermally-conductive pad, the first side disposed opposite the second side.

16. The temperature control device of claim 11 , wherein one or more of the plurality of fins comprises a perforation surrounded by a generally frusto-conically shaped rim nested inside another generally frusto-conically shaped rim surrounding a perforation in an adjacent fin of the plurality of fins.

17. The temperature control device of claim 11 , wherein one end of the plurality of fins comprises a plurality of lateral folds and the flat bottom comprises an aggregation of the lateral folds.

18. The temperature control device of claim 11 , further comprising a switch operable to electrically short the thermoelectric device during a passive mode of operation.

19. The temperature control device of claim 11 , wherein:

the plurality of electrical interconnects cover substantially all of the surface area of the interior surfaces of the first and second plates; and

the plurality of thermoelectric elements cover a minority of the surface area of the plurality of electrical interconnects.

20. A temperature control device, comprising a thermoelectric device and a first sink, wherein:

the thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects, the plurality of thermoelectric elements coupled between an interior surface of a first plate and an interior surface of a second plate;

the first sink comprises a flat bottom and a plurality of generally parallel fins extending out of the flat bottom;

the flat bottom is coupled to an exterior surface of the first plate by a coupling media; and

the thermoelectric device comprises a switch operable to electrically short the thermoelectric device during a passive mode of operation.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2019
From: MARLOW INDUSTRIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 048669/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2010
From: WOODS, MARK C.; RECINE, LEONARD J.; BIERSCHENK, JAMES L.; PARISH, OVERTON L.
To: MARLOW INDUSTRIES, INC.
Reel/Frame 024299/0158 →
Continuity (2)
Provisional Application 61151743 · Feb 11, 2009
Related Publication 20100199687A1 · Aug 12, 2010