Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth
There is disclosed methods of making photosensitive devices, such as flexible photovoltaic (PV) devices, through the use of epitaxial liftoff. Also described herein are methods of preparing flexible PV devices comprising a structure having a growth substrate, wherein the selective etching of protective layers yields a smooth growth substrate that us suitable for reuse.
1. A growth structure comprising:
a growth substrate, a sacrificial layer, a buffer layer, a first protective layer, a second protective layer, a third protective layer, a fourth protective layer, at least one epilayer, at least one contact, and a metal or alloy-coated host substrate,
wherein the sacrificial layer is positioned between the growth substrate and the at least one epilayer, the first and second protective layers are positioned between the growth substrate and the sacrificial layer, and the third and fourth protective layers are positioned between the sacrificial layer and the epilayer.
2. The structure of claim 1 , wherein the buffer layer is positioned between the first protective layer and the growth substrate.
3. The structure of claim 1 , wherein the growth substrate and the second protective layer comprise the same material.
4. The structure of claim 3 , wherein the same material is GaAs.
5. The structure of claim 3 , wherein the same material is InP.
6. The structure of claim 5 , wherein the first protective layer is selected from InGaAs, GaAsSb, InAlAs, AlAsSb and mixtures thereof.
7. The structure of claim 1 , wherein the growth substrate comprises a single crystal wafer material.
8. The structure of claim 7 wherein the growth substrate is selected from Ge, Si, GaAs, InP, GaN, AlN, and combinations thereof.
9. The structure of claim 7 , wherein the first protective layer is selected from InGaP, AlGaAs, InAlP, and mixtures thereof.
10. The structure of claim 1 , wherein the growth substrate, the buffer layer, and the second protective layer comprise the same material.
11. The structure of claim 10 , wherein the same material comprise InP.
12. The structure of claim 1 , wherein the at least one epilayer comprises at least one III-V material.
13. The structure of claim 1 , wherein the host substrate comprises at least one polymer selected from polyesters and polyimides.