IP Library Granted Patent US 8,399,093
Granted Patent B2
US 8,399,093 · App. 12/996,936 · Granted Mar 19, 2013

Process for preparing redispersible surface-modified silicon dioxide particles

Inventors: Wolfgang Lortz (Waechtersbach, DE); Gabriele Perlet (Grosskrotzenburg, DE); Uwe Diener (Grosskrotzenburg, DE); Sascha Reitz (Hanau, DE)
Assignee: Evonik Degussa GmbH
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,399,093
App. No.
12/996,936
Granted
Mar 19, 2013
Kind
B2
Abstract

Provided is a process for preparing surface-modified silicon dioxide particles with a mean particle diameter of at most 100 nm, involving (A) high-pressure grinding of a predispersion having (i) surface-modified silicon dioxide particles which are at least partly aggregated, are bonded to the surface-modifying component via Si—O—Si bonds, and still have reactive groups on their surface; (ii) an organosilicon compound which has a silicon-carbon bond and a functional group which can react with the reactive groups to form a covalent Si—O—Si bond; and (iii) a solvent, to form a dispersion; and (B) removing the liquid phase of the dispersion. Also provided are redispersible, surface-modified silicon dioxide particles obtained by this process, and their use in toner powders, silicone rubber, adhesives, and scratch-resistance surface coatings.

Claims (26)

1. A process for preparing surface-modified silicon dioxide particles with a mean particle diameter of at most 100 nm, the process comprising:

(I) high-pressure grinding of a predispersion comprising

(A1) initial surface-modified silicon dioxide particles which (A1a) are at least partly aggregated, (A1b) are bonded to a surface-modifying component via Si—O—Si bonds, and (A1c) comprise reactive groups on their surface after the grinding,

(A2) an organosilicon compound which has (A2a) a silicon-carbon bond and (A2b) a functional group which react with the reactive groups to form a covalent Si—O—Si bond, and

(A3) an organic, volatile solvent,

to form a dispersion; and

(II) removing a liquid phase of the dispersion by spray drying, to obtain the surface-modified silicon dioxide particles with the mean particle diameter of at most 100 nm,

wherein a proportion of the organic, volatile solvent (A3) in the predispersion is from 60 to 98% by weight.

2. The process of claim 1 , wherein the initial surface-modified silicon dioxide particles (A1) are of pyrogenic origin.

3. The process of claim 1 , wherein a proportion of the initial surface-modified silicon dioxide particles (A1), based on the predispersion, is 1 to 50% by weight.

4. The process of claim 1 , wherein the organosilicon compound (A2) is a silylamine.

5. The process of claim 1 , wherein a proportion of organosilicon compound (A2), based on the surface-modified silicon dioxide particles (A1), is from 0.01 to 10% by weight.

6. The process of claim 1 , wherein the high-pressure grinding (I) is carried out in such a way that the predispersion is divided into at least two substreams, and the substreams are placed under pressure and decompressed through one nozzle each to a common point of collision.

7. The process of claim 6 , wherein jets of the substreams have a speed of at least 300 m·s −1 .

8. The process of claim 1 , wherein the solvent (A3) consists essentially of methanol, ethanol, acetone, methyl ethyl ketone, 1-propanol, i-propanol, n-butanol, hexane, heptane, isooctane, petroleum ether, dipropyl ether, diisopropyl ether, tetrahydrofuran, tetrahydropyran, methyl acetate, ethyl acetate, or a mixture thereof.

9. The process of claim 1 , wherein the surface-modified silicon dioxide particles have a BET surface area of 80 to 400 m 2 /g.

10. The process of claim 1 , wherein the surface-modified silicon dioxide particles have a BET surface area of 150 to 350 m 2 /g.

11. The process of claim 7 , wherein the jets of the substreams have a speed of at least 400 to 1000 m·s −1 .

12. The process of claim 6 , wherein the jets of the substreams have a speed of at least 600 to 900 m·s −1 .

13. The process of claim 1 , wherein a tamped density of the surface-modified silicon dioxide particles is at most 50% greater than a tamped density silica of the initial surface-modified silicon dioxide particles.

14. The process of claim 1 , wherein a proportion of the organic, volatile solvent (A3) in the predispersion is from 60 to 95% by weight.

15. The process of claim 1 , wherein the surface-modified silicon dioxide particles have a methanol wettability of 20 to 90.

16. The process of claim 1 , wherein the surface-modified silicon dioxide particles have a methanol wettability of 40 to 80.

17. The process of claim 7 , wherein the predispersion is placed under a pressure of 50 to 500 MPa and decompressed through a nozzle,

wherein the nozzle has a bore diameter or a slot width of 0.05 to 1 mm, and

wherein the nozzle has a bore with a length/diameter ratio, or a slot with a depth/slot width ratio, of 1 to 10.

Assignments (2)
CHANGE OF NAME Recorded Jan 31, 2020
From: EVONIK DEGUSSA GMBH
To: EVONIK OPERATIONS GMBH
Reel/Frame 051765/0166 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2010
From: LORTZ, WOLFGANG; PERLET, GABRIELE; DIENER, UWE; REITZ, SASCHA
To: EVONIK DEGUSSA GMBH
Reel/Frame 025542/0104 →
Priority Claims (1)
EP 08160715 · Jul 18, 2008 · regional
Continuity (1)
Related Publication 20110086958A1 · Apr 14, 2011