Package-on-package type semiconductor package
Provided are a semiconductor package and a method for fabricating the same. The semiconductor package includes a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate and comprising a redistribution, and a molding layer molding the lower semiconductor chip, an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, with the upper package being stacked on the lower package. The semiconductor package further includes an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper and lower packages to each other, and a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper and lower packages to each other.
1. A semiconductor package comprising:
a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate, a redistribution, and a molding layer molding the lower semiconductor chip;
an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, the upper package being stacked on the lower package;
an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper package and the lower package to each other; and
a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper package and the lower package to each other,
wherein the dummy interconnector comprises at least one of a first dummy interconnector extending toward the lower semiconductor chip; and a second dummy interconnector disposed further adjacent to an edge portion of the upper substrate when compared to the first dummy interconnector to extend toward the lower substrate in an outer region of the lower semiconductor chip,
wherein the redistribution comprises:
a first redistribution connected to the electrical interconnector and electrically connected to the lower substrate; and
a second redistribution connected to the first dummy interconnector and not electrically connected to the lower substrate, and wherein the molding layer comprises at least one of a mold via hole exposing the first redistribution to provide a disposition space for the electrical interconnector, a first dummy mold via hole exposing the second redistribution to provide a disposition space for the first dummy interconnector, and a second dummy mold via hole providing a disposition space of the second dummy interconnector,
wherein the first dummy mold via hole has an empty space which is not filled with the first dummy interconnector.
2. A semiconductor package comprising:
a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate, a redistribution, and a molding layer molding the lower semiconductor chip;
an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, the upper package being stacked on the lower package;
an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper package and the lower package to each other; and
a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper package and the lower package to each other,
wherein the dummy interconnector comprises at least one of a first dummy interconnector extending toward the lower semiconductor chip; and a second dummy interconnector disposed further adjacent to an edge portion of the upper substrate when compared to the first dummy interconnector to extend toward the lower substrate in an outer region of the lower semiconductor chip and
wherein the upper substrate comprises a ball land connected to the electrical interconnector on a center portion thereof; and
the upper substrate comprises a first dummy ball land connected to the first dummy interconnector, the first dummy ball land having a size less than a size of the ball land on the edge portion thereof.
3. The semiconductor package of claim 2 , wherein the first dummy interconnector has a sectional area gradually increasing from an upper side connected to the first ball land to a lower side opposite to the upper side.
4. The semiconductor package of claim 3 , wherein the upper substrate further comprises a second dummy ball land connected to the second dummy interconnector and having a size equal to or less than a size of the ball land on the edge thereof.
5. The semiconductor package of claim 4 , wherein the second dummy interconnector has a same sectional area from an upper portion of the upper substrate toward a lower portion of the lower substrate or a sectional area gradually changing from the upper portion of the upper substrate toward the lower portion of the lower substrate.
6. The semiconductor package of claim 1 , wherein the electrical interconnector is disposed at a center portion of a bottom surface of the upper substrate, and the second dummy interconnector is disposed adjacent to the edge portion of the upper substrate when compared to the electrical interconnector.
7. The semiconductor package of claim 6 , wherein the second dummy interconnector is disposed at an edge portion of the molding layer corresponding to the outer region of the lower semiconductor chip.
8. The semiconductor package of claim 2 , wherein the electrical interconnector is disposed at a center portion of a bottom surface of the upper substrate, and the second dummy interconnector is disposed adjacent to the edge portion of the upper substrate when compared to the electrical interconnector.
9. The semiconductor package of claim 8 , wherein the second dummy interconnector is disposed at an edge portion of the molding layer corresponding to the outer region of the lower semiconductor chip.