Antenna for an electronic tag
The invention concerns an inductive element for forming an electromagnetic transponder antenna, comprising a first group of mutually parallel conductors coplanar in a first plane, a second group of mutually parallel conductors coplanar in a second plane parallel to the first plane, and an insulating material separating the two groups of conductors, one end of each conductor of the first group being connected to one end of a conductor of the second group whereof the other end is connected to one end of another conductor of the first group, the connections between the conductors being conductive via holes in the thickness of the insulating material.
1. An inductive element, characterized in that it comprises: a first group of parallel conductive tracks coplanar in a first plane;
a second group of parallel conductive tracks coplanar in a second plane parallel to the first plane; and
an insulating material separating the two groups of tracks, one end of each track of the first group being connected to an end of a track of the second group having its other end connected to an end of another track of the first group, the connections between the first and second groups of tracks being conductive vias that cross through the insulating material,
wherein the first group of parallel conductive tracks is superimposed in a first metal level of a semiconductor wafer and the second group of parallel conductive tracks is superimposed in a second metal level of the semiconductor wafer.
2. An antenna for receiving a radio-frequency transmission, characterized in that it comprises the inductive element of claim 1 .
3. An electromagnetic transponder comprising the antenna of claim 2 .
4. The transponder of claim 3 , wherein electronic circuits of the transponder are formed in the semiconductor wafer underlying the antenna.
5. The electromagnetic transponder of claim 3 , disposed on a metal surface of an object.
6. An object comprising at least one metal surface, comprising, against the at least one metal surface, the transponder of claim 3 .
7. An inductive element, comprising: an insulating material; a first group of conductive tracks on a first side of the insulating material, the first group of conductive tracks comprising a first track and a second track, the first group of conductive tracks being superimposed in a first metal level of a semiconductor wafer;
a second group of conductive tracks on a second side of the insulating material, the second group of conductive tracks comprising a third track and a fourth track, the second group of conductive tracks being superimposed in a second metal level of the semiconductor wafer; and
conductive connections between the first and second groups of conductive tracks, the conductive connections comprising a first conductive connection between the first track and the third track, a second conductive connection between the second track and the third track, and a third conductive connection between the second track and the fourth track, wherein each of the first, second and third conductive connections extends through the insulating material.
8. The inductive element of claim 7 , wherein the conductive connection comprises conductive vias extending through the insulating material.
9. An antenna for receiving a radio-frequency transmission comprising the inductive element of claim 7 .
10. An electromagnetic transponder comprising the antenna of claim 9 .
11. An object comprising at least one metal surface, comprising, against the at least one metal surface, the transponder of claim 10 .
12. A method of using a transponder comprising an antenna that includes an inductive element having an insulating material; a first group of conductive tracks on a first side of the insulating material, the first group of conductive tracks comprising a first track and a second track; a second group of conductive tracks on a second side of the insulating material, the second group of conductive tracks comprising a third track and a fourth track; and conductive connections between the first and second groups of tracks, the conductive connections comprising a first conductive connection between the first track and the third track, a second conductive connection between the second track and the third track, and a third conductive connection between the second track and the fourth track, wherein each of the first, second and third conductive connections extends through the insulating material, the first and second group of conductive tracks being superimposed a first and second metal level in a semiconductor wafer, respectively, the method comprising:
placing the transponder in contact with all object comprising metal at least at a surface of the object.
13. The method of claim 12 , whereby the transponder is affixed to the object.