Electronic device and method for producing electronic device

1. An electronic device comprised of a plurality of internal electrode layers and dielectric layers alternately laminated wherein

particle size of first dielectric particles which contact at one laminating direction end face of said internal electrode layer is larger than particle size of second dielectric particles which contact at another laminating direction end face of said internal electrode layers; and

a thickness of a first ceramic layer formed by said first dielectric particles is smaller than a thickness of a second ceramic layer formed by said second dielectric particles.

2. The electronic device as set forth in claim 1 , wherein

when the thickness of said first ceramic layer is defined as t 1 , the thickness of said second ceramic layer is defined as t 2 ,

0.160≦ t 1/( t 1 +t 2)≦0.275.

3. The electronic device as set forth in claim 1 , wherein

when the particle size of said first dielectric particles is r 1 , the particle size of said second dielectric particles is r 2 ,

r 1 /r 2≦2.17.

4. The electronic device as set forth in claim 1 , wherein

said first ceramic layer is formed by said first dielectric particles arranged in a plane parallel to a laminating plane, so that said single first dielectric particle exists in a laminating direction per one first ceramic layer.

5. The electronic device as set forth in claim 1 , wherein

said electronic device is multilayer ceramic capacitor.

6. A method for producing an electronic device comprising steps of;

preparing a paste for internal electrode layer including first ceramic particles and conductive particles,

preparing a paste for dielectric layer including second ceramic particles,

obtaining a green sheet by coating said paste for dielectric layer to a support body,

obtaining a sheet unit in which an internal electrode pattern layer is formed by said paste for internal electrode layer on said green sheet, and

obtaining a green chip by laminating said sheet unit, wherein

a density of said first ceramic particles existing near a face of said internal electrode pattern layer formed on said sheet unit, which does not contact to said green sheet, is larger than a density of said first ceramic particles existing near a face of said internal electrode pattern layer, which contacts to said green sheet.

7. The method for producing the electronic device as set forth in claim 6 further comprising,

drying said sheet unit at 80° C. or below.

8. The method for producing the electronic device as set forth in claim 6 , wherein

when a content of said conductive particles included in said internal electrode pattern layer is 100 parts by weight, a content of said first ceramic particles included in the internal electrode patter layer is 10 to 20 parts by weight.

9. The method for producing electronic device as set forth in claim 6 , wherein

said electronic device is a multilayer ceramic capacitor.