IP Library Granted Patent US 8,546,237
Granted Patent B2
US 8,546,237 · App. 12/872,609 · Granted Oct 1, 2013

Transferring and resizing of epitaxial film arrays and method thereof

Inventor: Majid Riaziat (San Jose, CA)
Assignee: Oepic Semiconductors, Inc.
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Quick Facts
Patent No.
US 8,546,237
App. No.
12/872,609
Granted
Oct 1, 2013
Kind
B2
Abstract

A method of transferring an epitaxial film from an original substrate to a destination substrate comprises: growing an epitaxial film grown with a sacrificial layer on the original substrate; patterning the epitaxial film into a plurality of sections; attaching the plurality of sections to a stretchable film; removing the plurality of sections attached to the stretchable film from the original substrate; stretching the sections apart as needed; and attaching a permanent substrate to the plurality of sections; and trimming the sizes of the sections as needed for precise positioning prior to integrated circuit device fabrication.

Claims (39)

1. A method of transferring an epitaxial film from an original substrate to a permanent substrate comprising:

growing the epitaxial film grown with a sacrificial layer on the original substrate;

patterning the epitaxial film into a plurality of sections;

attaching the plurality of sections to a stretchable film;

removing the plurality of sections attached to the stretchable film from the original substrate;

stretching the stretchable film to a size of the permanent substrate on which the plurality of sections is to be attached;

attaching the plurality of sections to a temporary substrate; and

attaching the permanent substrate to the plurality of sections.

2. The method of claim 1 further comprising removing the stretchable film.

3. The method of claim 1 further comprising etching away the sacrificial layer.

4. The method of claim 1 wherein growing the epitaxial film further comprises growing epitaxial material to provide rigidity to the epitaxial film.

5. The method of claim 1 further comprising depositing a protective layer on the epitaxial film.

6. The method of claim 5 wherein the protective layer is a protective metal layer.

7. The method of claim 5 wherein the protective layer is a flexible protective layer.

8. The method of claim 7 wherein the flexible protective layer is a polymer.

9. A method of transferring an epitaxial film from an original substrate to a permanent substrate comprising:

growing the epitaxial film grown with a sacrificial layer on the original substrate;

patterning the epitaxial film into a plurality of sections;

attaching the plurality of sections to a stretchable film;

stretching the stretchable film to a size of the permanent substrate on which the plurality of sections is to be attached;

attaching the plurality of sections to a temporary substrate;

removing the stretchable film; and

attaching the permanent substrate to the plurality of sections.

10. The method of claim 9 further comprising removing the plurality of sections attached to the stretchable film from the original substrate prior to attaching the permanent substrate to the plurality of sections.

11. The method of claim 10 further comprising etching away the sacrificial layer.

12. The method of claim 10 wherein growing the epitaxial film further comprises growing epitaxial material to provide rigidity to the epitaxial film.

13. The method of claim 10 further comprising depositing a protective layer on the epitaxial film.

14. The method of claim 9 further comprising stretching the stretchable film to the size of the permanent substrate prior to attaching the plurality of sections to the temporary substrate.

15. A method of transferring an epitaxial film from an original substrate to a permanent substrate comprising:

growing the epitaxial film grown with a sacrificial layer on the original substrate;

patterning the epitaxial film into a plurality of sections;

attaching the plurality of sections to a stretchable film;

removing the plurality of sections attached to the stretchable film from the original substrate;

stretching the stretchable film to a size of the permanent substrate;

attaching the plurality of sections to a temporary substrate;

removing the stretchable film; and

attaching the permanent substrate to the plurality of sections.

16. The method of claim 15 wherein growing the epitaxial film further comprises growing epitaxial material to provide rigidity to the epitaxial film.

17. The method of claim 15 further comprising depositing a protective layer on the epitaxial film.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2025
From: PATENT SAFE
To: NETFORCE OELABS, INC.
Reel/Frame 072122/0485 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 065557 FRAME 0695. ASSIGNOR(S) HEREBY CONFIRMS THE FOR PATENT SAFE, INC. Recorded Nov 20, 2023
From: OEPIC SEMICONDUCTORS, INC
To: PATENT SAFE, INC.
Reel/Frame 065631/0185 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2023
From: OEPIC SEMICONDUCTORS, INC
To: FOR PATENT SAFE, INC.
Reel/Frame 065557/0695 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2010
From: RIAZIAT, MAJID
To: OEPIC SEMICONDUCTORS, INC.
Reel/Frame 024918/0605 →
Continuity (1)
Related Publication 20120052663A1 · Mar 1, 2012