IP Library Granted Patent US 8,546,998
Granted Patent B2
US 8,546,998 · App. 12/997,090 · Granted Oct 1, 2013

Sandwich piezoelectric device with solid copper electrode

Inventor: David Alan Weston (Hendersonville, NC)
Assignee: Michelin Recherche et Technique S.A.
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Quick Facts
Patent No.
US 8,546,998
App. No.
12/997,090
Granted
Oct 1, 2013
Kind
B2
Abstract

Disclosed are apparatus and methodology for minimizing and compensating for cracking in piezoelectric devices so as to maintain long term functionality of the devices. Compensation for cracking is achieved by applying solid conductive electrodes over the entire surface of the piezoelectric device and extending the electrodes beyond the perimeter of the piezoelectric device. In this way electrical connections are maintained even in the presence of cracking. Cracking of the piezoelectric device is limited by minimizing the local bending moment of the piezoelectric device by way of applying insulative support materials that may vary in thickness.

Claims (37)

1. A piezoelectric device, comprising:

a layer of piezoelectric material having a first surface, a second surface, and a perimeter;

a first layer of conductive material completely covering said first surface and extending beyond the perimeter of said piezoelectric material;

a second layer of conductive material completely covering said second surface and extending beyond the perimeter of said piezoelectric material; and

a first insulating layer supporting said piezoelectric material and said first and second layers of conductive material;

a second insulating layer;

wherein said piezoelectric layer is sandwiched between said first and second conductive layers and said first insulating layer and said second insulating layer form outer sandwich layers for the piezoelectric layer and the first and second conductive layers, wherein the first insulating layer and the second insulating layer have different thicknesses.

2. The device of claim 1 , further comprising:

a first solder pad electrically coupled to said first layer of conductive material; and

a second solder pad electrically coupled to said second layer of conductive material.

3. The device of claim 1 , wherein the first and second insulating layers are FR4.

4. The device of claim 1 , wherein the first and second conductive layers are copper.

5. The device of claim 1 , wherein said piezoelectric material comprises lead zirconium titanate (PZT).

6. The device of claim 1 , further comprising:

an elastomeric layer having a base portion and a mesa portion,

wherein said first insulating layer is secured to said elastomeric layer with an adhesive.

7. The device of claim 6 , wherein said elastomeric layer is a rubber layer.

8. The device of claim 6 , wherein said adhesive is Chemloc®.

9. A method for preserving piezoelectric device functionality in the presence of stress induced cracks, comprising:

providing a layer of piezoelectric material having a first surface, a second surface, and a perimeter;

completely covering said first surface with a first layer of conductive material;

extending the first layer of conductive material beyond the perimeter of said piezoelectric material;

completely covering said second surface with a second layer of conductive material;

extending the second layer of conductive material beyond the perimeter of said piezoelectric material;

adhering at least one insulating support layer to at least one of said first and second layers of conductive material; and

adhering the at least one insulating support layer to an elastomeric material suitable for mounting to a tire, the elastomeric material having a base portion and a mesa portion, said at least one insulating support layer being secured to the elastomeric layer with an adhesive.

10. The method of claim 9 , wherein providing a layer of piezoelectric material comprises providing a layer of lead zirconium titanate (PZT).

11. The method of claim 9 , wherein the conductive material is copper.

12. The method of claim 9 , wherein the elastomeric material comprises rubber.

13. A tire patch, comprising:

a layer of piezoelectric material having a first surface, a second surface, and a perimeter;

a first layer of conductive material completely covering said first surface and extending beyond the perimeter of said piezoelectric material;

a second layer of conductive material completely covering said second surface and extending beyond the perimeter of said piezoelectric material; and

a first insulating layer supporting said piezoelectric material and said first and second layers of conductive material;

a second insulating layer disposed opposite the first insulating layer such that the layer of piezoelectric material is sandwiched between the first layer of conductive material and the second layer of conductive material and such that the first insulating layer and the second insulating layer form outer sandwich layers for the piezoelectric layer and the first and second conductive layers; and

an elastomeric layer secured to the first insulating layer.

14. The tire patch of claim 13 , wherein the first insulating layer and the second insulating layer have different thicknesses.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2023
From: MICHELIN RECHERCHE ET TECHNIQUE S.A.
To: COMPAGNIE GÉNÉRALE DES ETABLISSEMENTS MICHELIN
Reel/Frame 065018/0154 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2014
From: SOCIETE DE TECHNOLIGIE MICHELIN
To: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN
Reel/Frame 033125/0759 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2011
From: WESTON, DAVID ALAN
To: MICHELIN RECHERCHE ET TECHNIQUE S.A.
Reel/Frame 026031/0450 →
Continuity (1)
Related Publication 20110084574A1 · Apr 14, 2011