IP Library Granted Patent US 8,557,626
Granted Patent B2
US 8,557,626 · App. 12/794,257 · Granted Oct 15, 2013

Image sensor devices and methods for manufacturing the same

Inventors: Ming-Kai Liu (Taipei County, TW); Tzu-Wei Huang (Hsinchu County, TW); Jui-Hung Chang (Hsinchu, TW); Chia-Hui Huang (Hsinchu, TW); Teng-Sheng Chen (Hsinchu, TW)
Assignees: Omnivision Technologies, Inc.; VisEra Technologies Company Limited
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Quick Facts
Patent No.
US 8,557,626
App. No.
12/794,257
Granted
Oct 15, 2013
Kind
B2
Abstract

Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Claims (19)

1. A method for forming an image sensor device, comprising:

providing a photo sensor having a lens thereon;

forming a first sacrificial element on the lens;

forming an electromagnetic interference layer on the lens and the first sacrificial element;

removing the first sacrificial element and the electromagnetic interference layer on the first sacrificial element to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens;

forming a second sacrificial element in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed;

forming a light-shielding layer on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens; and

removing the second sacrificial element and the light-shielding layer on the second sacrificial element, to expose the center region of the selected portion of the lens to serve as a light transmitting region.

2. The method as claimed in claim 1 , wherein the step of removing the second sacrificial element and the light-shielding layer on the second sacrificial element forms a light-shielding pattern on the peripheral region of the selected portion of the lens, and on a top surface and a sidewall of the electromagnetic interference pattern.

3. The method as claimed in claim 1 , further comprising cleaning the light transmitting region and the light-shielding layer surface after the step of removing the second sacrificial element and the light-shielding layer on the second sacrificial element.

4. The method as claimed in claim 1 , wherein the lens has a planar upper surface.

5. The method as claimed in claim 1 , wherein the lens has a curved upper surface.

6. The method as claimed in claim 1 , wherein the step of removing the first sacrificial element and the electromagnetic interference layer on the first sacrificial element comprises:

subjecting an energy to the first sacrificial element to swell the first sacrificial element until bursting, wherein the first sacrificial element is an energy-induced swelling material.

7. The method as claimed in claim 1 , wherein the step of removing the first sacrificial element and the electromagnetic interference layer on the first sacrificial element comprises a laser cutting.

8. The method as claimed in claim 1 , wherein the step of removing the second sacrificial element and the light-shielding layer on the second sacrificial element comprises:

subjecting an energy to the second sacrificial element to swell the second sacrificial element until bursting, wherein the second sacrificial element is an energy-induced swelling material.

9. The method as claimed in claim 1 , wherein the step of removing the second sacrificial element and the light-shielding layer on the second sacrificial element comprises a laser cutting.

10. The method as claimed in claim 1 , wherein the photo sensor aligns to the light transmitting region.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 026563 FRAME 0895. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEES ARE OMNIVISION TECHNOLOGIES, INC. AND VISERA TECHNOLOGIES COMPANY LIMITED. Recorded Aug 11, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.; VISERA TECHNOLOGIES COMPANY LIMITED
Reel/Frame 026736/0545 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.
Reel/Frame 026563/0895 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2010
From: LIU, MING-KAI; HUANG, TZU-WEI; CHANG, JUI-HUNG; HUANG, CHIA-HUI; CHEN, TENG-SHENG
To: VISERA TECHNOLOGIES COMPANY LIMITED
Reel/Frame 024488/0618 →
Continuity (1)
Related Publication 20110298073A1 · Dec 8, 2011