Laser hammering technique for aligning members of a constructed array of optoelectronic devices
View Patent ↗A parallel transceiver includes a constructed array of dice. The constructed array comprises an integer number of dies that each have an integer number of optoelectronic devices arranged on the die. Each die forming the constructed array is attached to a respective tab of a shim that is fixed to a first lead frame. Each tab includes a bridge region and a mounting region. Each die is attached to a respective mounting region of a corresponding tab. When necessary, a laser hammering technique is performed whereby laser generated energy is applied along an axis in the bridge region of the shim to adjust the position of the optoelectronic devices on the die attached to the tab in one or more directions relative to the axis.
1. An optoelectronic module including a constructed array of N dies with M operational optoelectronic devices, where N and M are integers, the optoelectronic module, comprising:
a first lead frame having a first edge;
a second lead frame having a second edge, the second lead frame adjacent to the first lead frame, the first lead frame and the second lead frame forming a channel between the first edge and the second edge, the channel permitting the application of laser generated energy from laser sources in the vicinity of the channel; and
a shim attached to the first lead frame, the shim having a first mounting region and N tabs extending from the first mounting region beyond the edge of the first lead frame, the N tabs including a bridge region and a second mounting region, at least a portion of the bridge region traversing the channel, the second mounting region having a first surface for fixedly attaching an optoelectronic device and a second surface, wherein the constructed array is aligned by laser hammering a bridge region.
2. The optoelectronic module of claim 1 , wherein the N tabs extend beyond the edge of the first lead frame in a first direction and a second direction.
3. The optoelectronic module of claim 2 , wherein the first and second directions define a plane that is substantially coplanar with respective major surfaces of the first lead frame and the second lead frame.
4. The optoelectronic module of claim 3 , wherein a longitudinal axis of the bridge region forms an angle with respect to the first edge.
5. The optoelectronic module of claim 1 , wherein the first surface is opposed to the second surface.
6. The optoelectronic module of claim 1 , wherein the first lead frame includes a first recess shaped to receive the first mounting region.
7. The optoelectronic module of claim 1 , wherein each optoelectronic device comprises an integer number of vertical cavity surface emitting lasers.
8. The optoelectronic module of claim 7 , wherein the vertical cavity surface emitting lasers are arranged in a one-dimensional array.
9. The optoelectronic module of claim 1 , wherein laser hammering comprises directing laser energy from opposing directions through the channel.
10. The optoelectronic module of claim 1 , wherein the second surface of the second mounting region is coupled to the second lead frame with an epoxy layer that remains uncured until after laser hammering is complete and any shim material flow in the bridge region has returned to a solid at approximately ambient temperature.
11. The optoelectronic module of claim 1 , wherein alignment of each of the respective optoelectronic devices forming the constructed array is verified and the epoxy layer along the second surface of the shim and a surface of the second lead frame is cured.
12. The optoelectronic module of claim 1 , wherein the channel thermally isolates the constructed array from a transmitter driver.
13. The optoelectronic module of claim 1 , further comprising:
a third lead frame adjacent to the first lead frame, wherein a channel between the first lead frame and the third lead frame thermally isolates a fixed array from a receiver circuit.
14. The optoelectronic module of claim 1 , wherein the shim is stamped, cut or milled from a sheet.
15. The optoelectronic module of claim 1 , wherein the shim is made from an alloy.
16. The optoelectronic module of claim 1 , wherein the shim is attached to the first lead frame with a weld.
17. The optoelectronic module of claim 16 , wherein the weld is selected from the group consisting of spot, edge, and plug.
18. The optoelectronic module of claim 6 , wherein the first recess is in a portion of a larger recess arranged in the first lead frame.
19. The optoelectronic module of claim 18 , wherein the larger recess enables a driver integrated circuit to lie against the first lead frame.
20. The optoelectronic module of claim 19 , wherein the first lead frame includes a slot that provides access to wire bonds that couple the driver integrated circuit to a printed circuit board.