Apparatus and methods for thermal management of light emitting diodes
View Patent ↗An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.
1. An apparatus comprising:
a printed circuit board (PCB) having a metal layer disposed on a first surface of the PCB;
a core having a core first surface and a core second surface;
a backplane having a backplane first surface and a backplane second surface, the backplane first surface abutting the core first surface;
a pad defined by a portion of the metal layer;
a heat slug having a heat slug first surface and a heat slug second surface, the heat slug second surface secured to the pad;
an electronics package disposed against the heat slug first surface to conduct heat away from the electronics package to the backplane; and
means for conducting heat from the electronics package, the heat slug and the pad, wherein the means for conducting heat remains electronically isolated from the core,
wherein the means for conducting passes through the core, the heat slug and the backplane and wherein the means for conducting is in electrical communication with the electronics package.
2. The apparatus of claim 1 , wherein the means for conducting heat remains electrically isolated from the backplane, with passing through the backplane.
3. The apparatus of claim 1 , wherein the means for conducting is electrically non-conducting.
4. The apparatus of claim 1 , wherein the means for conducting passes through the metal layer.
5. An apparatus comprising:
a printed circuit board (PCB) having a metal layer;
a core having a core first surface and a core second surface;
a backplane having a backplane first surface and a backplane second surface, the backplane first surface abutting the core first surface;
a pad defined by a portion of the metal layer;
a heat slug having a heat slug first surface and a heat slug second surface, the heat slug second surface arranged on the pad;
an electronics package disposed against the heat slug first surface to conduct heat away from the electronics package to the backplane; and
means for conducting heat from the electronics package, the heat slug and the pad, wherein the means for conducting heat remains electronically isolated from the core,
wherein the means for conducting passes through the core, the heat slug and the backplane and wherein the means for conducting is in electrical communication with the electronics package.
6. The apparatus of claim 5 , wherein the means for conducting heat remains electrically isolated from the backplane, with passing through the backplane.
7. The apparatus of claim 5 , wherein the means for conducting is electrically non-conducting.
8. The apparatus of claim 5 , wherein the means for conducting passes through the metal layer.
9. An apparatus comprising:
a printed circuit board (PCB) having a metal layer;
a core having a core first surface and a core second surface;
a backplane having a backplane first surface and a backplane second surface, the backplane first surface abutting the core first surface;
a pad defined by a portion of the metal layer;
a heat slug having a heat slug first surface and a heat slug second surface, the heat slug second surface arranged on the pad;
electrical components disposed against the heat slug first surface to conduct heat away from the electrical components to the backplane; and
means for conducting heat from the electrical components, the heat slug and the pad, wherein the means for conducting heat remains electronically isolated from the core,
wherein the means for conducting passes through the core, the heat slug and the backplane and wherein the means for conducting is in electrical communication with the electrical components.
10. The apparatus of claim 9 , wherein the means for conducting heat remains electrically isolated from the backplane, with passing through the backplane.
11. The apparatus of claim 9 , wherein the means for conducting is electrically non-conducting.
12. The apparatus of claim 9 , wherein the means for conducting passes through the metal layer.