Mounting structure for solid state light sources
View Patent ↗A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon; a drive board carrying drive circuitry for the light radiation source, the aforementioned drive board being mounted on the support board and extending peripherally with respect to the aforementioned submount; electrical interface connections between the submount and the drive board for connecting the light radiation source to the drive circuitry; and mechanical and thermal interface connections between the submount and the support board.
1. A mounting structure for solid-state light sources, comprising:
a support board;
a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon;
a drive board carrying drive circuitry for said at least one solid-state light radiation source, said drive board being mounted on said support board and extending peripherally with respect to said submount, said drive board being positioned entirely at a level below a level of said submount;
electrical interface connections between the submount and the drive board for connecting said at least one light radiation source to said drive circuitry; and
mechanical and thermal interface connections between said submount and said support board.
2. The structure as claimed in claim 1 , wherein said at least one light radiation source is an LED.
3. The structure as claimed in claim 1 , wherein said mechanical and thermal interface connections comprise a thermally conductive adhesive or solder mass arranged between said submount and said support board.
4. The structure as claimed in claim 1 , wherein said drive board has an aperture and wherein said submount is arranged opposite said aperture facing said support board with a thermally conductive mass interposed between said support board said submount.
5. The structure as claimed in claim 4 , wherein said thermally conductive mass is selected from a thermally conductive adhesive and a thermally conductive grease.
6. The structure as claimed in claim 1 , wherein said electrical interface connections are in the form of wires or connectors.
7. The structure as claimed in claim 1 , wherein said electrical interface connections extend through via holes provided in said submount.
8. The structure as claimed in claim 1 , wherein said electrical interface connections comprise columnar formations which mechanically support said submount over said support board.
9. The structure as claimed in claim 8 , wherein said columnar formations rest on said drive board, at least a part of the columnar formation being electrically connected to said drive board.
10. The structure as claimed in claim 1 , wherein said submount comprises a ceramic material.
11. The structure as claimed in claim 1 , wherein said submount is a double-sided metal core or ceramic core board having conductive vias extending therethrough to provide at least part of said electrical interface connections.
12. The structure as claimed in claim 1 , wherein said at least one light radiation source is an LED directly applied onto said submount.
13. The structure as claimed in claim 1 , wherein said mechanical and thermal interface connections comprise a thermally conductive adhesive or solder mass arranged between said submount and said support board, with the arrangement of said drive board in between.
14. The structure as claimed in claim 1 , wherein said electrical interface connections are in the form of Surface Mount Device (SMD) connectors.