Universal radio frequency shield removal
Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.
1. A method for removing a component attached to a PCB from said PCB, comprising:
contacting said component with a contact plate in thermal communication with a heating element such that a vacuum retention port of a channel including at least one jog and extending through said contact plate to a vacuum port is covered by said component, wherein the contact plate comprises a platform extending from said contact plate that has a substantially identical profile as said component;
melting solder attaching said component to said PCB in response to said contacting;
creating a vacuum at said vacuum retention port such that said component is held against said contact plate by said vacuum; and
moving said contact plate with respect to said PCB during said creating such that said component is retained on said contact plate and removed from said PCB.
2. The method of claim 1 , wherein said component is an electro-magnetic shield.
3. The method of claim 2 , wherein said electro-magnetic shield is a radio-frequency (RF) shield.
4. The method of claim 1 , further comprising:
selecting a contact plate from a plurality of different contact plates.
5. The method of claim 3 , further comprising:
removably attaching said contact plate to said heating element.
6. The method of claim 5 , wherein said removably attaching includes clamping said contact plate to said heating element using a lever-actuated clamping mechanism.
7. A method for removing a component attached to a PCB from said PCB, comprising:
removably attaching a contact plate to a heating element in thermal communication therewith using a lever-actuated clamping mechanism;
contacting said component with said contact plate such that a vacuum retention port extending through said contact plate is covered by said component, wherein the contact plate comprises a platform extending from said contact plate that has a substantially identical profile as said component, and wherein no other portion of said PCB or component is contacted by said contact plate other than said platform;
melting solder attaching said component to said PCB in response to said contacting;
creating a vacuum at said vacuum retention port such that said component is held against said contact plate by said vacuum; and
moving said contact plate with respect to said PCB during said creating such that said component is retained on said contact plate and removed from said PCB,
wherein said component is an radio-frequency (RF) electro-magnetic shield.
8. The method of claim 1 , further comprising operating a temperature control module to control said heating element.
9. The method of claim 1 , further comprising resting said PCB with the component facing said contact plate on PCB supports.
10. The method of claim 1 , further comprising placing said PCB on a PCB holder configured to move from a loading position to a work position such that said PCB holder is disposed below an actuator configured to lower said contact plate into contact with said PCB.
11. The method of claim 1 , further comprising releasing said component into a component disposal drawer.