Methods and devices for high accuracy deposition on a continuously moving substrate
A method is explained that allows for a via to be filled with a dispensed material while the substrate is in continuous movement. A device is described that allows for a via to be filled while the target substrate is in continuous movement. The device consists of a material jetting system, a machine vision system that can detect the optimum trigger point, an electronic control circuit, a feedback mechanism and a web handling provision.
1. A deposition method comprising:
continuously moving a substrate having a plurality of a set of vias;
using an individual execution thread for each set of vias on the substrate such that at least a first set of vias is configured to be filled while a second set of vias is monitored for at least position and speed;
using a detector system and a deposition system calibrated to both use identical reference frames;
using a detector system which monitors positions of a via in the substrate over time to determine X and Y position over time; and
processing the position to determine when to start the deposition system;
using a separate triggering system to phase lock the start of each execution thread and minimize any drift of a via in the field of view of the detector system;
wherein the substrate is continuously moving.
2. The method of claim 1 wherein via density on the substrate is 1 via/cm 2 or less.
3. A deposition method comprising:
continuously moving a substrate having a plurality of a set of vias;
using an individual execution thread for each set of vias on the substrate such that at least a first set of vias is configured to be filled while a second set of vias is monitored for at least position and speed;
using a detector system and a deposition system calibrated to both use identical reference frames; and
using a shaped substrate support to tension and flatten the substrate.
4. The method of claim 3 comprising:
wherein the shaped substrate support comprises a roller having a plurality of grooves.
5. The method of claim 4 comprising:
wherein the grooves each correspond to a column of vias in the substrate.
6. A deposition method comprising:
continuously moving a substrate having a plurality of a set of vias;
using an individual execution thread for each set of vias on the substrate such that at least a first set of vias is configured to be filled while a second set of vias is monitored for at least position and speed;
using a detector system and a deposition system calibrated to both use identical reference frames; and
using a shaped substrate support wherein the support is configured to provide backlighting of a filled via.