Organic light-emitting diode display and manufacturing method thereof

1. A method for manufacturing an organic light emitting diode (OLED) display, the method comprising:

forming an organic light emitting diode on a side of a substrate;

depositing a liquid organic film through a first opening in a first mask to cover the organic light emitting diode, and hardening the organic film; and

depositing an inorganic film through a second opening in a second mask to cover the organic film,

wherein the first opening has a step,

wherein L 1 ′ is a diameter of the first opening in μm,

wherein L 2 ′ is a diameter of the second opening in μm,

wherein A is a height of the step in μm, and

wherein L 2 ′-L 1 ′≧2 (1.5214×10 −3 A+210 μm).

2. A method for manufacturing an organic light emitting diode (OLED) display, the method comprising:

forming an organic light emitting diode on a side of a substrate;

forming an organic film for covering the organic light emitting diode on the side of the substrate and in an organic film deposition area; and

forming an inorganic film for covering the organic film on the substrate and in an inorganic film deposition area,

wherein L 1 is a diameter of the organic film deposition area in μm, L 2 is a diameter of the inorganic film deposition area in μm, D is a thickness of the organic film within the organic film deposition area in μm, and L 2 -L 1 >2 (171D+150μm),

wherein the organic film is generated through spreading and hardening of a liquid organic material such that the thickness of the organic film abruptly changes at a boundary of the organic film deposition area and a tail having a gradual thickness change is formed outside of the organic film deposition area.

3. The method of claim 2 , wherein 200 μm≦(L 2 -L 1 )≦6000 μm.

4. A method for manufacturing an organic light emitting diode (OLED) display, the method comprising:

forming an organic light emitting diode on a side of a substrate;

forming an organic film for covering the organic light emitting diode on the side of the substrate and in an organic film deposition area; and

forming an inorganic film for covering the organic film on the substrate and in an inorganic film deposition area,

wherein forming the organic film comprises: positioning a first mask having a first opening corresponding to the organic light emitting diode; and depositing a material of the organic film through the first opening,

wherein forming the inorganic film comprises: positioning a second mask having a second opening corresponding to the organic film deposition area where the organic film is formed on the substrate; and depositing a material of the inorganic film through the second opening,

wherein the first opening has a step in which a diameter of the first opening on a rear side of the first mask facing the substrate is greater than a diameter of the first opening on a surface side of the first mask opposite the rear side,

wherein L 1 ′ is the diameter of the first opening on the surface side of the first mask in μm,

wherein L 2 ′ is a diameter of the second opening in μm,

wherein A is a height of the step in μm, and

wherein L 2 ′-L′≧2 (1.5214×10 −3 A+210 μm).

5. The method of claim 4 , wherein 200 μm≦(L 2 ′-L 1 ′)≦6000 μm.

6. An organic light emitting diode (OLED) display comprising:

a substrate;

an organic light emitting diode on the substrate;

an organic film configured to cover the organic light emitting diode on the substrate in an organic film deposition area having a first diameter; and

an inorganic film configured to cover the organic film on the substrate in an inorganic film deposition area having a second diameter, wherein L 1 is the first diameter of the organic film deposition area in μm, wherein L 2 is the second diameter of the inorganic film deposition area in μm, wherein D is a thickness of the organic film within the organic film deposition area in μm, and wherein L 2 -L 1 ≧2 (171D+150 μm),

wherein the organic film is generated through spreading of a liquid organic material such that the thickness of organic film abruptly changes at a boundary of the organic film deposition area and such that a tail having a gradual thickness change is formed outside of the organic film deposition area.

7. The organic light emitting diode display of claim 6 , wherein 200 μm≦(L 2 -L 1 )≦6000 μm.

8. The organic light emitting diode display of claim 6 , wherein the organic film comprises a hardened liquid-deposited organic film.