MEMS element
A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer ( 34 ) on a first side of a substrate ( 32 ); providing a trench ( 40 ) in the material later ( 34 ); etching material from the trench ( 40 ) such as to also etch the substrate ( 32 ) from the first side of the substrate ( 32 ); grinding the substrate ( 32 ) from a second side of the substrate to expose the trench ( 40 ); and using the exposed trench ( 40 ) as an etch hole. The exposed trench ( 40 ) is used as an etch hole for releasing a portion of the material layer ( 34 ), for example a beam resonator ( 12 ), from the substrate ( 32 ). An input electrode ( 6 ), an output electrode ( 8 ), and a top electrode ( 10 ) are provided.
1. A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of:
providing a material layer on a first side of a substrate;
providing a trench in the material later;
etching material from the trench such as to also etch the substrate from the first side of the substrate;
grinding the substrate from a second side of the substrate to expose the trench; and
using the exposed trench as an etch hole for releasing a portion of the material layer from the substrate.
2. A method of manufacturing an electronic device according to claim 1 , further comprising sealing the exposed trench.
3. A method of manufacturing an electronic device according to claim 2 , wherein sealing the exposed trench provides a vacuum cavity around the released portion of the material layer.
4. A method of manufacturing an electronic device according to claim 1 , wherein the released portion of the material layer is a beam resonator.
5. A method of manufacturing an electronic device according to claim 4 , wherein the beam resonator is a single crystalline resonator.
6. A method of manufacturing an electronic device according to claim 1 , further comprising providing an input electrode, an output electrode, and a top electrode.
7. A method of manufacturing an electronic device according to claim 1 , wherein the electronic device is manufactured using a CMOS or a BIMOS process.
8. A method as claimed in claim 1 of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, which is provided with an input electrode, an output electrode, a top electrode, and a beam resonator, the beam resonator is defined in a cavity, the cavity provides a gap between the beam resonator and each of the input electrode, the output electrode, and the top electrode, the method comprising the steps of:
providing the substrate with a first side and a second side, the second side opposite the first side;
providing a lower sacrificial layer on the first side of the substrate;
providing the material layer in the form of an active layer on the lower sacrificial layer;
providing an upper sacrificial layer on the active layer;
providing a top electrode on a portion of the upper sacrificial layer;
etching trenches for the input electrode and the output electrode through the upper sacrificial layer and the active layer such that a portion of the active layer is defined as the resonator, wherein the resonator is separated from the input and output electrodes by spacer material;
filling the etched trenches;
removing the material filling some of the filled etched trenches;
further etching said some of the trenches to perform said etching of the substrate from the first side of the substrate such as to define extended tranches;
filling the extended trenches with a sacrificial material; and
performing said grinding to remove a portion of the substrate from the second side such that the extended trenches are accessible,
wherein using the exposed trench as an etch hole comprises
removing the material filling the extended trenches;
removing the spacer material in contact with the resonator;
removing the lower sacrificial layer in contact with the resonator; and
removing the upper sacrificial layer in contact with the resonator.
9. A method of manufacturing an electronic device according to claim 8 , further comprising:
providing a sealant layer on the second side of the substrate such that a sealed vacuum cavity is formed around the resonator.
10. A method of manufacturing an electronic device according to claim 8 , further comprising:
providing a device layer on the top electrode and on a portion of the upper sacrificial layer;
providing a glue layer on the a device layer; and
providing a glass wafer on the glue layer.
11. The method of claim 1 , further comprising:
the portion comprising a part of the MEMS element.
12. The method of claim 1 , wherein providing a trench in the material layer, further comprises:
providing at least two trenches in the material layer as etch holes for releasing the portion from the substrate.
13. The method of claim 1 , wherein using the exposed trench as an etch hole, further comprises:
removing material filling trenches to provide a cavity around the released portion of the material layer.