Method of assembly of articles
An assembly method for first and second articles is disclosed. A first substrate with a plurality of first articles and a second substrate with a plurality of second articles are selected. The articles on the flexible substrate webs with different pitches are assembled together by displacing portions between the first articles of one web out of plane to move the first articles on that web to the same shorter pitch as the second articles on the other web, aligning the two webs to register corresponding first and second articles on the two webs, and assembling the corresponding articles together. The assembly may be used for example in the making of RFID tags, labels and inlays.
1. An assembly method, comprising:
selecting a first flexible planar substrate with a plurality of first articles disposed in a linear array thereon with a first spacing between adjacent first articles;
selecting a second planar substrate with a plurality of second articles disposed in a linear array thereon with a second spacing between adjacent second articles that is shorter than the first spacing;
displacing portions of the first substrate between adjacent first articles out of the plane of the first substrate to thereby draw adjacent first articles closer to one another;
aligning the first and second substrates so that each first article is disposed in succession adjacent a corresponding second article in succession; and
assembling each first article to the corresponding second article.
2. The method of claim 1 , wherein the substrate is a plastic, paper, or foil.
3. The method of claim 1 , wherein adjacent first elements are drawn to within the second spacing from one another.
4. The method of claim 1 , wherein displacing the portions of the first substrate between adjacent first elements out of the plane of the first substrate comprises applying negative pressure to the portions of the first substrate to draw the portions out of plane.
5. The method of claim 1 , wherein displacing the portions of the first substrate between adjacent first elements out of the plane of the first substrate comprises applying positive pressure to the portions of the first substrate to impel the portions out of plane.
6. The method of claim 5 , wherein applying positive pressure comprises applying a mechanical force to the portions of the first substrate to impel the portions out of plane.
7. The method of claim 1 , wherein displacing includes applying a vacuum or suction force.
8. The method of claim 1 , wherein the first and second articles are components of an RFID device.
9. The method of claim 1 , wherein the first and second articles are antenna elements.
10. The method of claim 1 , further comprising after assembling the articles:
cutting the second substrate between adjacent second articles; and
releasing the displaced portions of the first substrate into the plane of first substrate.
11. The method of claim 1 , wherein assembling the articles comprises one selected from the group consisting of applying adhesive to at least one of the articles, applying pressure to the articles, applying heat to the articles, soldering the articles, and welding the articles.
12. The method of claim 1 , wherein the first articles are RFID inlays and the second articles are materials for an apparel hang tag.
13. The method of claim 1 , wherein displacing the portions of the first substrate between adjacent first elements out of the plane of the first substrate comprises the step of wrapping the first substrate around a toothed wheel.
14. The method of claim 1 , wherein displacing the portions of the first substrate between adjacent first elements out of the plane of the first substrate comprises force created by a stepper motor or dancer bar.
15. The method of claim 8 , wherein one of the components is a chip or strap.