Electronic packaging apparatus and electronic packaging method
A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.
1. An electronic packaging apparatus for mounting electronic components onto a substrate, the electronic packaging apparatus comprising:
a release tape;
a bonding tool that holds a first electronic component against the release tape; and
a bonding head to which the bonding tool is attached, wherein the bonding tool comprises:
a contact surface that is parallel to the substrate and contacts the release tape when the bonding tool holds the first electronic component;
a first suction opening that is formed on the contact surface to hold the first electronic component by a suction force;
a trench that is formed within the contact surface by concaving midst of the contact surface, and surrounds the first suction opening; and
a second suction opening that is formed inside the trench to hold the release tape by a suction force, and
the bonding head has a common exhaust-air path to emit air through both the first suction opening and the second suction opening.
2. The electronic packaging apparatus according to claim 1 , wherein the trench extends in accordance with a shape of the contact surface.
3. The electronic packaging apparatus according to claim 1 , wherein the trench is shaped to encompass the first suction opening.
4. The electronic packaging apparatus according to claim 1 , wherein the trench includes straight lines parallel to each other.
5. The electronic packaging apparatus according to claim 1 , wherein
a second electronic component is mounted on the first electronic component, in which an area on which the second electronic component is mounted is larger than an area on which the first electronic component is mounted, and
the trench extends in an area outside of a mounting position of the second electronic component.
6. The electronic packaging apparatus according to claim 1 , wherein the trench accommodates an expanded part of the release tape, expanded due to heat.
7. The electronic packaging apparatus according to claim 1 , wherein the release tape comprises an opening aligned with the first suction opening.