Solid-state image sensing device and method of manufacturing the same
By selectively anisotropically etching a stack film formed to cover a plurality of photodiodes and a gate electrode layer of a MOS transistor, the stack film remains on each of the plurality of photodiodes to form a lower antireflection coating and the stack film remains on a sidewall of the gate electrode layer to form a sidewall. Using the gate electrode layer and the sidewall as a mask, an impurity is introduced to form a source/drain region of the MOS transistor. After the impurity was introduced, an upper antireflection coating is formed at least on a lower antireflection coating. At least any of the upper antireflection coating and the lower antireflection coating is etched such that the antireflection coatings on the two respective photodiodes are different in thickness from each other.
1. A method of manufacturing a solid-state image sensing device including a plurality of photoelectric conversion portions constituting a plurality of pixels, an insulating gate field effect transistor portion, and a plurality of first films formed on said plurality of photoelectric conversion portions respectively, the method comprising the steps of:
forming a stack film constituted of a plurality of insulating films so as to cover said plurality of photoelectric conversion portions and a gate electrode layer of said insulating gate field effect transistor portion;
selectively anisotropically etching said stack film such that said stack film remains on each of said plurality of photoelectric conversion portions to form a lower film and such that said stack film remains on a sidewall of said gate electrode layer to form a sidewall insulating film;
forming a source/drain region of said insulating gate field effect transistor portion by introducing an impurity into a region not covered with said gate electrode layer and said sidewall insulating film;
forming an upper film at least on said lower film after introduction of said impurity; and
etching at least any of said upper film and said lower film such that said first films on at least two photoelectric conversion portions of said plurality of photoelectric conversion portions are different in thickness from each other, wherein
said step of etching at least any of said upper film and said lower film includes the step of etching said lower film after said sidewall insulating film is formed and before said upper film is formed.
2. The method of manufacturing a solid-state image sensing device according to claim 1 , wherein
said step of etching at least any of said upper film and said lower film includes the step of etching at least said upper film after said upper film is formed.
3. The method of manufacturing a solid-state image sensing device according to claim 2 , wherein
said step of etching at least any of said upper film and said lower film includes the step of exposing said lower film by etching said upper film and thereafter etching exposed said lower film.
4. A method of manufacturing a solid-state image sensing device including a plurality of photoelectric conversion portions constituting a plurality of pixels, an insulating gate field effect transistor portion, and a plurality of first films formed on said plurality of photoelectric conversion portions respectively, the method comprising the steps of:
forming a stack film constituted of a plurality of insulating films so as to cover said plurality of photoelectric conversion portions and a gate electrode layer of said insulating gate field effect transistor portion;
selectively anisotropically etching said stack film such that said stack film remains on each of said plurality of photoelectric conversion portions to form a lower film and such that said stack film remains on a sidewall of said gate electrode layer to form a sidewall insulating film;
forming a source/drain region of said insulating gate field effect transistor portion by introducing an impurity into a region not covered with said gate electrode layer and said sidewall insulating film;
forming an upper film at least on said lower film after introduction of said impurity; and
etching at least any of said upper film and said lower film such that said first films on at least two photoelectric conversion portions of said plurality of photoelectric conversion portions are different in thickness from each other, wherein
said plurality of pixels include a first pixel, a second pixel and a third pixel for sensing images of light having colors different from one another, and
said step of etching at least any of said upper film and said lower film includes the steps of
etching respective said lower films on said photoelectric conversion portions of both of said second pixel and said third pixel while leaving said lower film on said photoelectric conversion portion of said first pixel after said sidewall insulating film is formed and before said upper film is formed, and
etching said upper film on said photoelectric conversion portion of said third pixel after said upper film is formed.
5. The method of manufacturing a solid-state image sensing device according to claim 4 , wherein
said step of etching at least any of said upper film and said lower film includes the step of exposing said lower film by etching said upper film of said third pixel and thereafter etching exposed said lower film.
6. The method of manufacturing a solid-state image sensing device according to claim 1 , wherein
said upper film is formed from a single-layered silicon nitride film.