Polyimide precursor composition, use of the of the same, and production method of the same
An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine.
1. A polyimide precursor composition containing at least an isocyanate compound and an imidized tetracarboxylic acid represented by General Formula (1):
wherein each R independently represents a tetravalent organic group; each R′ independently represents a divalent organic group; 1 represents an integer of 0 to 20 and wherein the isocyanate compound and the imidized tetracarboxylic acid represented by General Formula (1) have no covalent bond.
2. The polyimide precursor composition as set forth in claim 1 , further containing a diamine represented by General Formula (2):
[Chem. 2]
H 2 N—R″—NH 2 (2)
wherein R″ represents a divalent organic group.
3. The polyimide precursor composition as set forth in claim 1 , wherein R in General Formula (1) is a tetravalent organic group selected from General Formula Group (1):
4. The polyimide precursor composition as set forth in claim 1 , wherein R′ in General Formula (1) has at least a divalent organic group selected from General Formula Group (2):
wherein o, p, and q each independently represent an integer of 1 to 30; R 1 and R 2 each independently represent an alkyl group having 1 to 12 carbon atoms or an aromatic group; m represents an integer of 1 to 40; n represents an integer of 1 to 20; and R 3 and R 4 each independently represent an alkylene group having 1 to 12 carbon atoms.
5. The polyimide precursor composition as set forth in claim 2 , wherein R″ in General Formula (2) is a divalent organic group selected from General Formula Group (3):
wherein o, p, and q each independently represent an integer of 1 to 30; R 1 and R 2 each independently represent an alkyl group having 1 to 12 carbon atoms or an aromatic group; m represents an integer of 1 to 40; n represents an integer of 1 to 20; and R 3 and R 4 each independently represent an alkylene group having 1 to 12 carbon atoms.
6. A polyimide precursor composition solution obtained by dissolving a polyimide precursor composition as set forth in claim 1 so that the polyimide precursor composition solution has a solute concentration of 40 to 90% by weight.
7. A polyimide coating film obtained from either a polyimide precursor composition as set forth in claim 1 .