IP Library Granted Patent US 8,733,182
Granted Patent B2
US 8,733,182 · App. 13/531,970 · Granted May 27, 2014

Force sensor assembly and method for assembling a force sensor assembly

Inventors: Alex Huizinga (Almelo, NL); Robert Zwijze (Vriezenveen, NL); Martijn Pijpers (Enschede, NL); Bennie Berkel (Wierden, NL)
Assignee: Sensata Technologies, Inc.
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Quick Facts
Patent No.
US 8,733,182
App. No.
13/531,970
Granted
May 27, 2014
Kind
B2
Abstract

The force sensor assembly has axis of measurement along an axial direction of the force sensor assembly and comprises a force ring provided with at least two sensing elements, a printed circuit board having electronic components thereon, a covering plate for holding the printed circuit board onto the force ring, and a sensor cap covering the printed circuit board and covering plate and attached to the force ring. Manufacturing is easily accomplished using stacking, fixing and welding.

Claims (34)

1. A force sensor assembly having an axis of measurement along an axial direction of the force sensor assembly, comprising:

a deformable force ring having force-receiving regions arranged to receive oppositely directed forces whereby the force ring may deform in response to application of forces to the force-receiving regions, the force ring having at least two sensing elements arranged to generate a signal corresponding to the degree of force ring deformation;

a printed circuit board disposed directly against a surface of the force ring, the board having electronic components thereto, the sensing elements being electrically coupled to the electronic components;

a covering plate in engagement with the printed circuit board and connected to the force ring for holding the printed circuit board against the surface of the force ring; and

a sensor cap covering the printed circuit board and covering plate and attached to the force ring.

2. The force sensor assembly of claim 1 , wherein the covering plate further accommodates an electrical connector extending through the sensor cap.

3. The force sensor assembly of claim 2 , wherein the covering plate comprises a plastic material.

4. he force sensor assembly of claim 1 , wherein the covering plate comprises an internal metal clip secured to the force ring.

5. The force sensor assembly of claim 4 , wherein the covering plate is provided with orientation elements to define a selected orientation of the sensors and the printed circuit board.

6. The force sensor assembly of claim 5 , wherein the sensor cap is provided with at least one orientation element.

7. The force sensor assembly of claim 1 , further comprising:

a sealing member of compressible material between the covering plate and the sensor cap.

8. The force sensor assembly of claim 1 , wherein the at least two sensing elements are evenly distributed on a circle on a top surface of the force ring.

9. The force sensor assembly of claim 8 , wherein the covering plate further accommodates an electrical connector extending through the sensor cap, and wherein the covering plate comprises an internal metal clip secured to the force ring.

10. A force sensor assembly having an axis of measurement along an axial direction of the force sensor assembly, comprising:

an elastically deformable force ring having force-receiving regions arranged to receive oppositely directed forces whereby the force ring may deform in response to application of forces to the force-receiving regions, the force ring having at least two sensing elements arranged to generate a signal corresponding to the degree of force ring deformation, the at least two sensing elements comprise four strain gauges arranged in a double parallel Wheatstone bridge configuration;

a printed circuit board disposed on and supported by a surface of the force ring, the board having electronic components thereto, the strain gages being electrically coupled to the electronic components;

a covering plate in engagement with the printed circuit board and connected to the force ring for holding the printed circuit board against the surface of the force ring; and

a sensor cap covering the printed circuit board and covering plate and attached to the force ring.

11. The force sensor assembly of claim 10 , further comprising:

a sealing member of compressible material between the covering plate and the sensor cap, wherein the covering plate further accommodates an electrical connector extending through the sensor cap, and wherein the covering plate comprises an internal metal clip.

12. The force sensor assembly of claim 1 , wherein the at least two sensing elements each have a sensitivity orientation in a plane corresponding to a top surface of the force ring, the sensitivity orientations being directed at an angle to the center axis of the force sensor assembly.

13. The force sensor assembly of claim 12 , wherein the force ring is provided with profiling features.

14. The force sensor assembly of claim 13 , wherein the covering plate further accommodates an electrical connector extending through the sensor cap, and wherein the covering plate comprises an internal metal clip.

15. The force sensor assembly of claim 1 , wherein the printed circuit board and the covering plate are provided with openings.

16. The force sensor assembly of claim 15 , wherein the at least two sensing elements are covered with a protective material in the openings.

17. The force sensor assembly of claim 1 , wherein the force ring is provided with assembly features allowing attachment of the cover plate.

18. The force sensor assembly of claim 1 , wherein the sensor cap is provided with at least one orientation element.

19. A method of assembling a force sensor assembly, the method comprising:

stacking a printed circuit board having electronic components with a covering plate;

fixing the printed circuit board and the covering plate on a force ring provided with at least two sensing elements, by attaching the covering plate to the force ring to sandwich the printed circuit board between the covering plate and a surface of the force ring;

electrically connecting the at least two sensing elements to the printed circuit board; and

welding an outer rim and an inner rim of a sensor cap covering the printed circuit board and covering plate to the force ring.

20. The method as defined in claim 19 wherein the step of electrically connecting the sensing element to the printed circuit board comprises aligning the sensing elements with at least one aperture in the printed circuit board and effecting wire bonds between the sensing elements and components on the printed circuit board through the at least one aperture.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2012
From: HUIZINGA, ALEX; ZWIJZE, ROBERT; PIJPERS, MARTIJN; BERKEL, BENNIE
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 028436/0517 →
Priority Claims (1)
EP 11173545 · Jul 12, 2011 · regional
Continuity (1)
Related Publication 20130014595A1 · Jan 17, 2013