IP Library Granted Patent US 8,772,397
Granted Patent B2
US 8,772,397 · App. 11/794,334 · Granted Jul 8, 2014

Heat stabilized moulding composition

Inventors: Pieter Gijsman (Beek, NL); Wilhelmus J. M. Sour (Maastricht, NL); Rudy Rulkens (Cadier en Keer, NL); Robert H. C. Janssen (Elsloo, NL)
Assignee: DSM IP Assets B.V.
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Quick Facts
Patent No.
US 8,772,397
App. No.
11/794,334
Granted
Jul 8, 2014
Kind
B2
Abstract

Non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.

Claims (8)

1. A thermoplastic moulding composition comprising:

a) a polymer composition comprising at least one thermoplastic polyamide selected from the group consisting of polyamide-6, polyamide-6,6 and mixtures thereof having a weight average molecular mass Mw of at most 50,000 g/mol;

b) 0.20 to 5 parts by weight (pbw) relative to 100 pbw of the polymer composition in the moulding composition of a first thermo-stabilizing system consisting of finely dispersed elementary iron powder having a weight average particle size (dm) of at most 100 μm; and

c) 0.001-2 pbw relative to 100 pbw of the polymer composition in the moulding composition of a second thermo-stabilizing system consisting of a copper salt, wherein

the moulding composition exhibits reduced deterioration when exposed to an elevated temperature of 215° C. for a prolonged time period of 500 hours as compared to an identical moulding composition including a CuI/KI stabilization system but not including the elementary iron powder.

2. The moulding composition as in claim 1 , wherein the copper salt is a copper halogenide/alkalihalogenide combination.

3. The moulding composition as in claim 2 , wherein the copper salt is CuI/KI.

4. A moulded part which comprises the moulding composition according to any one of claims 1 - 3 .

Assignments (2)
NUNC PRO TUNC ASSIGNMENT Recorded May 27, 2025
From: DSM IP ASSETS B.V.
To: ENVALIOR B.V.
Reel/Frame 071393/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2008
From: GIJSMAN, PIETER; SOUR, WILHELMUS JOSEPHUS MARIA; RULKENS, RUDY; JANSSEN, ROBERT HENDRIK CATHARINA
To: DSM IP ASSETS B.V.
Reel/Frame 020539/0510 →
Priority Claims (1)
EP 05075064 · Jan 12, 2005 · regional
Continuity (1)
Related Publication 20080146718A1 · Jun 19, 2008