Image sensor module and camera module using same
An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a metal layer. The rigid-flex board defines a through hole penetrating its upper surface and its lower surface. An upper pad is positioned on an upper side surface of the rigid-flex board. The image sensor is positioned on the lower surface, and includes an image surface facing the through hole. A metal layer covers on a top surface and/or a bottom surface of the supporting plate, and a lower pad is positioned on a lower side surface of the supporting plate and connects to the metal layer. The supporting plate is positioned on the lower surface, and the image sensor is received between the rigid-flex board and the supporting plate. The metal sheet is electrically connected between the lower pad and the upper pad.
1. An image sensor module, comprising:
a rigid-flex board comprising an upper surface, a lower surface opposite to the upper surface, and an upper side surface connected between the upper surface and the lower surface; the rigid-flex board defining a through hole penetrating the upper surface and the lower surface, the rigid-flex board comprising an upper pad positioned on the upper side surface;
an image sensor positioned on the lower surface of the rigid-flex board, and comprising an image surface facing and aligning with the through hole;
a supporting plate comprising a top surface, a bottom surface opposite to the top surface, and a lower side surface connected between the top surface and the bottom surface; the supporting plate comprising a metal layer and a lower pad, the metal layer covering on the top surface and/or the bottom surface, the lower pad positioned on the lower side surface and connecting to the metal layer; the supporting plate positioned on the lower surface of the rigid-flex board, and the image sensor received between the rigid-flex board and the supporting plate; and
a metal sheet electrically connecting the lower pad to the upper pad.
2. The image sensor module of claim 1 , wherein the supporting plate defines a receiving recess on the top surface, and the receiving recess receives the image sensor therein.
3. The image sensor module of claim 1 , wherein the rigid-flex board comprises a flexible printed circuit board (FPCB), an adhering layer, and a semi-solidified glue layer; the FPCB is sandwiched between the adhering layer and the semi-solidified glue layer; the adhering layer comprises the upper surface facing away the FPCB; the semi-solidified glue layer comprises the lower surface facing away the FPCB.
4. The image sensor module of claim 3 , wherein the upper pad positioned on the rigid-flex board is electrically connected to the FPCB.
5. The image sensor module of claim 1 , wherein the metal layer covers on the bottom surface of the supporting plate.
6. The image sensor module of claim 1 , wherein the supporting plate defines a lower notch on the lower side surface, and the lower pad is positioned in the lower notch.
7. The image sensor module of claim 1 , wherein the rigid-flex board defines an upper notch on the upper side surface, and the upper pad is positioned in the upper notch.
8. A camera module, comprising:
an image sensor module, comprising:
a rigid-flex board comprising an upper surface, a lower surface opposite to the upper surface, and an upper side surface connected between the upper surface and the lower surface; the rigid-flex board defining a through hole penetrating the upper surface and the lower surface, the rigid-flex board comprising an upper pad positioned on the upper side surface;
an image sensor positioned on the lower surface of the rigid-flex board, and comprising an image surface facing and aligning with the through hole;
a supporting plate comprising a top surface, a bottom surface opposite to the top surface, and a lower side surface connected between the top surface and the bottom surface; the supporting plate comprising a metal layer and a lower pad, the metal layer covering on the top surface and/or the bottom surface, the lower pad positioned on the lower side surface and connecting to the metal layer; the supporting plate positioned on the lower surface of the rigid-flex board, and the image sensor received between the rigid-flex board and the supporting plate; and
a metal sheet electrically connecting the lower pad to the upper pad; and
a lens module, comprising:
a lens holder positioned on the upper surface of the rigid-flex board; and
a lens unit received in the lens holder.
9. The camera module of claim 8 , wherein the supporting plate defines a receiving recess on the top surface, and the receiving recess receives the image sensor therein.
10. The camera module of claim 8 , wherein the rigid-flex board comprises a flexible printed circuit board (FPCB), an adhering layer, and a semi-solidified glue layer; the FPCB is sandwiched between the adhering layer and the semi-solidified glue layer; the adhering layer comprises the upper surface facing away the FPCB; the semi-solidified glue layer comprises the lower surface facing away the FPCB.
11. The camera module of claim 10 , wherein the upper pad positioned on the rigid-flex board is electrically connected to the FPCB.
12. The camera module of claim 8 , wherein the metal layer covers on the bottom surface of the supporting plate.
13. The camera module of claim 8 , wherein the supporting plate defines a lower notch on the lower side surface, and the lower pad is positioned in the lower notch.
14. The camera module of claim 8 , wherein the rigid-flex board defines an upper notch on the upper side surface, and the upper pad is positioned in the upper notch.